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Name: EP2AGX260FF35I3NAB
Brand: Intel
SKU: EP2AGX260FF35I3NAB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel EP2AGX260FF35I3NAB

Part No.:: EP2AGX260FF35I3NAB

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 612 I/O 1152FBGA

In Stock:: 2115

Quantity:: Add To Cart

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EP2AGX260FF35I3NAB Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Arria II GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
10260
NumberofLogicElements/Cells:
244188
TotalRAMBits:
12038144
NumberofI/O:
612
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

EP2AGX260FF35I3NAB this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EP2AGX260FF35I3NAB price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EP2AGX260FF35I3NAB to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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EP2AGX260FF35I3NAB information

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EP2AGX260FF35I3NAB Application Introduction

EP2AGX260FF35I3NAB is a field-programmable gate array (FPGA) with advanced features, widely used in various high-performance computing and signal processing applications. It offers abundant logic elements, high-speed transceivers, and versatile I/O capabilities.

Application Scenario:

In telecommunications infrastructure, EP2AGX260FF35I3NAB can be utilized for signal processing tasks such as modulation/demodulation, encoding/decoding, and protocol handling.

Circuit Design:

To effectively utilize EP2AGX260FF35I3NAB in a signal processing application, consider the following design guidelines:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable and clean power delivery to EP2AGX260FF35I3NAB and associated components. Utilize low-dropout regulators (LDOs), bypass capacitors, and power planes to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortions, reflections, and crosstalk. Use controlled impedance traces, proper termination techniques, and ground/power planes to maintain signal integrity and minimize transmission line effects.

3. Thermal Management:

Ensure adequate thermal dissipation for EP2AGX260FF35I3NAB to prevent overheating and ensure reliable operation. Incorporate heat sinks, thermal vias, and proper airflow in the system design to dissipate heat effectively.

4. Clocking Strategy:

Design a robust clocking architecture to provide stable and synchronized clock signals to EP2AGX260FF35I3NAB and other components. Use low-jitter clock sources, clock distribution networks, and clock gating techniques to minimize skew and ensure proper timing.

5. Design Optimization:

Optimize the FPGA design for resource utilization, performance, and power consumption. Utilize efficient coding practices, resource sharing, and pipelining techniques to maximize the utilization of EP2AGX260FF35I3NAB resources and minimize power consumption.

Considerations:

When designing with EP2AGX260FF35I3NAB, consider the following factors for optimal performance and reliability:

- Design Partitioning: Partition the design into smaller modules for easier development, testing, and maintenance.

- Timing Closure: Perform thorough timing analysis and optimization to meet timing constraints and ensure reliable operation at the target clock frequency.

- Design Verification: Implement comprehensive verification strategies, including simulation, emulation, and hardware testing, to validate the design functionality and performance.

- Design Security: Implement security features such as bitstream encryption and authentication to protect the FPGA configuration and intellectual property from unauthorized access or tampering.

- Compliance and Standards: Ensure compliance with industry standards and regulations relevant to the application domain, such as telecommunications standards for signal processing applications.

EP2AGX260FF35I3NAB FAQ

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3. Are the EP2AGX260FF35I3NAB price and inventory displayed accurate?

The price and inventory of EP2AGX260FF35I3NAB fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of EP2AGX260FF35I3NAB?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EP2AGX260FF35I3NAB we delivered, we will accept the replacement or return of the EP2AGX260FF35I3NAB only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of EP2AGX260FF35I3NAB.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations