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Name: DS92LV18TVV/NOPB
Brand: Texas Instruments
SKU: DS92LV18TVV/NOPB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments DS92LV18TVV/NOPB

Part No.:: DS92LV18TVV/NOPB

Manufacturer:: Texas Instruments

Package:: 80-LQFP

Datasheet:: DS92LV18TVV/NOPB.pdf

Description:: IC SER/DES LVDS 18BIT BUS 80LQFP

In Stock:: 1583

Quantity:: Add To Cart

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DS92LV18TVV/NOPB Typical application Circuitry

DS92LV18TVV NOPB

The DS92LV18TVV/NOPB is a SerDes (Serializer/Deserializer) chip designed by Texas Instruments, optimized for high-speed data communication. It's part of the LVDS (Low Voltage Differential Signaling) family, specifically engineered to facilitate robust and efficient data transmission over a differential signaling pathway. This chip is adept at converting parallel data into serialized data and vice versa, making it an invaluable component in applications requiring fast data transfer over a limited number of physical connections, such as in telecommunications, data storage systems, and high-speed networking.

Key Features and Specifications:

- High-Speed Data Transmission: Supports efficient, high-speed data communication, crucial for applications demanding rapid data transfer.

- LVDS Interface: Employs LVDS technology to minimize power consumption while maximizing data transfer rates, essential for maintaining signal integrity over longer distances.

- Flexible Data Widths: Adaptable to various data widths, facilitating customization to specific application requirements.

- Integrated Clock Data Recovery (CDR): Features built-in CDR for reliable data synchronization, reducing the need for external timing components.

- Low EMI Emission: Designed to emit low levels of electromagnetic interference, enhancing overall system performance in sensitive applications.

Application Scenario: High-Speed Data Transfer in a Data Center

In a data center, the DS92LV18TVV/NOPB is deployed within a high-speed backplane to facilitate rapid data communication between servers and storage arrays, ensuring efficient data flow within the infrastructure.

Circuit Design Methodology:

1. Power Supply Connections (VCC and GND):

- VCC: Connect the VCC pins to a stable 3.3V power supply, providing the necessary power for operation.

- GND: The ground plane of the system needs to be firmly attached to the ground pins. It is advised to use decoupling capacitors close to the VCC pins in order to filter out power supply noise.

2. Parallel Data Interface (D0-Dx Pins):

- Interface these pins with the parallel data source or destination, configuring them according to the required data width for the application. The careful alignment of data paths is crucial for accurate data serialization/deserialization.

3. LVDS Differential Pairs (LVDSIN+, LVDSIN-; LVDSOUT+, LVDSOUT-):

- LVDSIN+/-: Connect the LVDS input differential pair to the serialized data source.

- LVDSOUT+/-: Connect the LVDS output differential pair to the receiving device, ensuring proper termination and impedance matching for signal integrity.

4. Clock Connections (CLKIN, CLKOUT):

- CLKIN: Attach this pin to an external clock source if necessary, providing timing for data serialization.

- CLKOUT: This can be utilized as an output to synchronize downstream devices with the serialized data stream.

5. Configuration and Control (MODE SELECT, ENABLE):

- Use configuration pins to set the operation mode of the DS92LV18TVV/NOPB, adapting it to the specific needs of the data center infrastructure.

- The ENABLE pin can be used to activate or deactivate the SerDes functionality as needed, providing flexibility in managing data flow.

Design Considerations:

- Signal Integrity: Given the high-speed nature of the DS92LV18TVV/NOPB, ensuring signal integrity through controlled impedance traces and differential pair routing is essential.

- Power Integrity: The stability of the power supply directly impacts the performance of the DS92LV18TVV/NOPB. Implement comprehensive power management strategies to ensure a clean, stable supply.

- Thermal Management: High-speed operation can lead to increased thermal output. Implement cooling solutions or thermal management strategies to maintain operational temperatures within safe limits.

- EMI Mitigation: While the DS92LV18TVV/NOPB is designed for low EMI emissions, additional measures such as shielding or filtering may be necessary in particularly sensitive applications.

- Reliability: In data center environments, where uptime is critical, designing for reliability includes considerations for redundancy, failover mechanisms, and diagnostic monitoring.

Incorporating the DS92LV18TVV/NOPB into a data center's high-speed backplane exemplifies its capability to bolster data communication efficiency, underscoring the chip's role in supporting the backbone of modern data infrastructure. This application highlights the importance of SerDes technology in facilitating rapid, reliable data exchanges crucial for the operation of contemporary data centers.

DS92LV18TVV/NOPB information

DS92LV18TVV/NOPB Specifications

Packaging:
Tray
Series:
-
ProductStatus:
Active
Function:
Serializer/Deserializer
DataRate:
2.376Gbps
InputType:
BLVDS, LVTTL
OutputType:
BLVDS, LVDS, LVTTL
NumberofInputs:
18/1
NumberofOutputs:
1/18
Voltage-Supply:
3.15V ~ 3.45V
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of DS92LV18TVV/NOPB.

(3)The PartNo is unused and only in the original unpacked packaging.

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