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Name: BGM13P22F512GA-V2R
Brand: Silicon Labs
SKU: BGM13P22F512GA-V2R
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Silicon Labs BGM13P22F512GA-V2R

Part No.:: BGM13P22F512GA-V2R

Manufacturer:: Silicon Labs

Package:

Datasheet:: BGM13P22F512GA-V2R.pdf

Description:: RX TXRX MOD BLUETOOTH CHIP SMD

In Stock:: 3361

Quantity:: Add To Cart

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BGM13P22F512GA-V2R Specifications

Package/Case:
Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
Blue Gecko
ProductStatus:
Active
RFFamily/Standard:
Bluetooth
Protocol:
Bluetooth v5.0
Modulation:
GFSK
Frequency:
2.4GHz
DataRate:
-
Power-Output:
8dBm
Sensitivity:
-
SerialInterfaces:
I²C, I²S, SPI, UART
AntennaType:
Integrated, Chip
UtilizedIC/Part:
EFR32BG
MemorySize:
512kB Flash, 64kB RAM
Voltage-Supply:
-
Current-Receiving:
9.8mA
Current-Transmitting:
9.5mA
MountingType:
Surface Mount

BGM13P22F512GA-V2R this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including BGM13P22F512GA-V2R price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for BGM13P22F512GA-V2R to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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BGM13P22F512GA-V2R information

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BGM13P22F512GA-V2R Typical application Circuitry

BGM13P22F512GA-V2R

The BGM13P22F512GA-V2R is a powerful Bluetooth Low Energy (BLE) module from Silicon Labs' Blue Gecko series, designed to support complex wireless communication tasks in Internet of Things (IoT) applications. It incorporates an ARM Cortex-M4 core and a high-performance radio transceiver, making it suitable for a broad range of applications that require efficient data processing and robust wireless capability.

Key Features and Specifications:

- Bluetooth 5.0 Capabilities: Offers enhanced throughput, extended advertising features, and improved interoperability with other Bluetooth devices.

- Integrated ARM Cortex-M4 Processor: Enables complex algorithm processing and multitasking within the module, providing substantial computational power.

- 512 KB RAM and 64 KB Flash Memory: Plenty of room for data and application code storage.

- Low Energy Consumption: Optimized for applications requiring long battery life.

- Full GPIO Suite: Allows for versatile interfacing options with various peripherals.

Application Scenario: Smart Industrial Sensor Network

In this application, the BGM13P22F512GA-V2R is utilized in an industrial setting to facilitate a network of sensors monitoring various parameters such as temperature, pressure, and machine performance, transmitting this data wirelessly to a central monitoring system.

Circuit Design Methodology:

1. Power Supply Integration:

- Power Requirements: Connect the BGM13P22F512GA-V2R to a regulated 3.3V power source. Consider using a power management IC if battery operation is intended.

- Decoupling Capacitors: To ensure dependable operation, place capacitors close to the power pins to stabilize the voltage and filter out noise.

2. Microcontroller Communication:

- UART Interface: Establish UART communication between the BGM13P22F512GA-V2R and any auxiliary microcontrollers or peripheral devices for robust data exchange. Connect the TX and RX pins, and ensure proper voltage level matching.

- Programming and Debugging Interface: Provide easy access to the SWD (Serial Wire Debug) interface, including connections for SWCLK and SWDIO, to facilitate programming and troubleshooting.

3. Sensor Integration:

- Digital Sensor Inputs: Utilize the GPIOs to connect digital sensors for monitoring industrial parameters. Ensure that the sensors operate within the input voltage specifications of the GPIOs to prevent damage.

- Analog Sensor Integration: If analog sensors are used, connect them to the ADC-capable pins on the BGM13P22F512GA-V2R. Include signal conditioning circuits such as amplifiers or filters as needed to maintain signal integrity.

4. Antenna Configuration:

- Onboard Antenna: The module comes with an integrated antenna. Ensure that the antenna's placement on the PCB is free from metal obstructions for optimal wireless performance.

5. Network Configuration and Management:

- Wireless Network Setup: Configure the BGM13P22F512GA-V2R to operate within a mesh network, enabling sensors to communicate data back to the central hub efficiently.

Design Considerations:

- EMI/EMC Compliance: In an industrial environment, electromagnetic interference can be significant. Design the PCB and select components that minimize EMI/EMC issues.

- Device Security: Implement robust security measures to protect sensitive industrial data transmitted over Bluetooth, using encryption and secure connection protocols.

- Reliability and Durability: Choose components rated for industrial temperature ranges and capable of withstanding harsh environments.

- Maintenance and Accessibility: Design the system so that it is easily accessible for maintenance and upgrades, including easy access to programming interfaces and battery replacement if applicable.

By leveraging the capabilities of the BGM13P22F512GA-V2R in a smart industrial sensor network, the setup exemplifies how advanced BLE modules can be utilized to enhance connectivity and functionality in critical applications, ensuring real-time monitoring and efficient management of industrial operations. This approach highlights the module's ability to handle high data throughput and its adaptability in complex network configurations.

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6. What is the process for return or replacement of BGM13P22F512GA-V2R?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BGM13P22F512GA-V2R we delivered, we will accept the replacement or return of the BGM13P22F512GA-V2R only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of BGM13P22F512GA-V2R.

(3)The PartNo is unused and only in the original unpacked packaging.

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