What is the Additional Feature ?

Name: APA300-FGG144I
Brand: Microchip Technology
SKU: APA300-FGG144I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Microchip Technology APA300-FGG144I

Part No.:: APA300-FGG144I

Manufacturer:: Microchip Technology

Package:: 144-LBGA

Datasheet:: APA300-FGG144I.pdf

Description:: IC FPGA 100 I/O 144FBGA

In Stock:: 3575

Quantity:: Add To Cart

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APA300-FGG144I Specifications

Package/Case:
144-LBGA
Packaging:
Tray
Series:
ProASICPLUS
ProductStatus:
Active
NumberofLABs/CLBs:
-
NumberofLogicElements/Cells:
-
TotalRAMBits:
73728
NumberofI/O:
100
NumberofGates:
300000
Voltage-Supply:
2.3V ~ 2.7V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 85°C (TA)

APA300-FGG144I this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including APA300-FGG144I price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for APA300-FGG144I to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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APA300-FGG144I information

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APA300-FGG144I application case analysis in emerging technology fields

APA300-FGG144I is a field-programmable gate array (FPGA) device manufactured by Microchip Technology Inc. It belongs to the APA family of FPGAs and offers a versatile platform for implementing custom digital logic designs.

Application Scenario:

In aerospace applications, APA300-FGG144I can be utilized to control and manage various subsystems of a satellite, such as attitude control, communication, and payload management.

System Design:

To design a satellite subsystem using APA300-FGG144I, consider the following steps:

1. Subsystem Partitioning:

Identify the different subsystems of the satellite, such as attitude determination and control, power management, and data handling. Partition the overall functionality into smaller modules suitable for implementation on the APA300-FGG144I FPGA.

2. Hardware Description:

Write hardware description language (HDL) code, such as Verilog or VHDL, to describe the behavior and interconnections of the digital logic components within each subsystem. Utilize the features and resources available in APA300-FGG144I, such as logic cells, memory blocks, and I/O pins.

3. Integration:

Integrate the individual subsystem designs into a cohesive system by connecting their inputs and outputs appropriately. Utilize the internal routing resources of APA300-FGG144I to establish communication paths between different modules.

4. Verification:

Perform functional simulation and verification to ensure that the implemented design meets the specified requirements and behaves as expected under different operating conditions. Use simulation tools compatible with APA300-FGG144I to validate the design's functionality.

5. Deployment:

Once the design is verified, program the APA300-FGG144I FPGA with the synthesized bitstream generated from the HDL code. Interface the FPGA with other satellite subsystems and perform rigorous testing to validate its performance in a simulated or actual space environment.

Benefits:

The use of APA300-FGG144I in satellite subsystems offers several advantages:

- Flexibility: The reprogrammable nature of FPGAs allows for easy modification and adaptation of the satellite's functionality to changing mission requirements.

- Integration: By consolidating multiple functions onto a single FPGA device, APA300-FGG144I enables compact and efficient satellite designs, reducing overall system complexity and weight.

- Performance: The high-speed operation and parallel processing capabilities of FPGAs enhance the performance of critical subsystems, such as real-time data processing and communication.

- Reliability: FPGAs are inherently robust and resistant to radiation and harsh environmental conditions, making them well-suited for space applications with stringent reliability requirements.

Considerations:

When utilizing APA300-FGG144I in satellite design, it's essential to consider factors such as:

- Radiation Hardening: Implement mitigation techniques to ensure the reliability of the FPGA in the presence of radiation-induced effects, such as single-event upsets (SEUs) and total ionizing dose (TID) effects.

- Power Consumption: Optimize the FPGA design and operation to minimize power consumption and extend the satellite's battery life during mission duration.

- Redundancy: Implement redundancy and fault-tolerant mechanisms at both the hardware and software levels to enhance the satellite's resilience to failures and increase mission success probability.

- Thermal Management: Ensure adequate thermal dissipation and temperature control within the satellite's enclosure to prevent overheating of the APA300-FGG144I FPGA and other onboard electronics.

- Compliance: Verify that the FPGA design complies with relevant space industry standards and regulations, such as those specified by organizations like NASA or the European Space Agency (ESA).

APA300-FGG144I FAQ

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3. Are the APA300-FGG144I price and inventory displayed accurate?

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6. What is the process for return or replacement of APA300-FGG144I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the APA300-FGG144I we delivered, we will accept the replacement or return of the APA300-FGG144I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of APA300-FGG144I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations