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Name: 5SGXMBBR3H43C2N
Brand: Intel
SKU: 5SGXMBBR3H43C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMBBR3H43C2N

Part No.:: 5SGXMBBR3H43C2N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXMBBR3H43C2N.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 3148

Quantity:: Add To Cart

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5SGXMBBR3H43C2N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMBBR3H43C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMBBR3H43C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMBBR3H43C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMBBR3H43C2N information

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5SGXMBBR3H43C2N Application Introduction

5SGXMBBR3H43C2N is a high-performance FPGA (Field-Programmable Gate Array) chip, offering advanced capabilities for various design projects, especially in the field of digital logic and signal processing.

Application Scenario:

In digital signal processing applications, 5SGXMBBR3H43C2N can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively utilize 5SGXMBBR3H43C2N in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption and ensure reliable operation of 5SGXMBBR3H43C2N. Utilize power gating, dynamic voltage scaling, and clock gating to minimize power consumption during idle or low activity periods.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout to minimize signal distortions, reflections, and crosstalk. Use proper termination techniques, controlled impedance traces, and signal integrity analysis tools to maintain reliable signal transmission and reception.

3. Thermal Management:

Manage thermal issues effectively to prevent overheating and ensure optimal performance of 5SGXMBBR3H43C2N. Employ proper heatsinking, thermal vias, and airflow design to dissipate heat generated during operation. Monitor junction temperatures and implement thermal shutdown mechanisms to prevent damage due to excessive heat.

4. Timing Closure:

Optimize timing constraints and perform thorough timing analysis to ensure timing closure in your design. Utilize advanced synthesis and place-and-route optimization techniques to meet timing requirements and minimize clock skew and setup/hold violations.

5. Design Partitioning:

Partition the design into logical blocks or modules to facilitate easier design implementation and debugging. Utilize hierarchical design methodologies and IP core integration to manage complexity and improve design reusability and scalability.

Considerations:

When designing with 5SGXMBBR3H43C2N, consider the following factors for optimal performance and reliability:

- Resource Utilization: Efficiently utilize FPGA resources such as logic elements, memory blocks, and DSP slices to minimize resource wastage and maximize design efficiency.

- Design Constraints: Pay attention to design constraints such as maximum clock frequency, input/output pin placement, and resource utilization constraints to ensure compatibility with target FPGA device and meet design specifications.

- Design Validation: Thoroughly validate the design through simulation, emulation, and hardware testing to verify functional correctness, performance, and reliability before deployment in the target application.

- Design Security: Implement appropriate security measures such as bitstream encryption, IP protection, and design obfuscation to safeguard intellectual property and prevent unauthorized access or tampering of the FPGA design.

- Design Documentation: Maintain comprehensive design documentation including design specifications, block diagrams, timing constraints, and test plans to facilitate design review, debugging, and future maintenance.

5SGXMBBR3H43C2N FAQ

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3. Are the 5SGXMBBR3H43C2N price and inventory displayed accurate?

The price and inventory of 5SGXMBBR3H43C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMBBR3H43C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMBBR3H43C2N we delivered, we will accept the replacement or return of the 5SGXMBBR3H43C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMBBR3H43C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations