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Name: 5SGXMB9R3H43C3G
Brand: Intel
SKU: 5SGXMB9R3H43C3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMB9R3H43C3G

Part No.:: 5SGXMB9R3H43C3G

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2925

Quantity:: Add To Cart

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5SGXMB9R3H43C3G Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMB9R3H43C3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB9R3H43C3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB9R3H43C3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB9R3H43C3G information

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5SGXMB9R3H43C3G Application Introduction

5SGXMB9R3H43C3G is a high-performance FPGA from Altera, now part of Intel, offering extensive capabilities for complex digital designs. This guide provides design optimization techniques for effective usage of 5SGXMB9R3H43C3G, focusing on power management, signal integrity, and thermal management.

Application Scenario:

In communication systems, 5SGXMB9R3H43C3G can be utilized to handle high-speed data processing and signal modulation tasks, leveraging its robust logic resources and high-speed transceivers.

Design Optimization Techniques:

1. Power Management:

Efficient power management is crucial for 5SGXMB9R3H43C3G. Implementing proper power distribution networks (PDNs) with low impedance paths ensures stable power delivery. Use multiple decoupling capacitors of varying values close to the power pins to filter high and low-frequency noise.

2. Signal Integrity:

To maintain signal integrity in designs using this chip, use controlled impedance traces for high-speed signals. Implement differential pairs for high-speed data lines and ensure proper termination resistors are placed to match the characteristic impedance of the transmission lines.

3. Thermal Management:

Effective thermal management is essential for maintaining the performance of 5SGXMB9R3H43C3G. Use heatsinks or active cooling solutions to dissipate heat. Properly plan the PCB layout to avoid heat concentration and ensure uniform heat distribution across the board.

4. Clock Management:

Utilizing the clock management features of this chip efficiently can significantly enhance performance. Use dedicated clock management blocks (CMTs) to generate low-jitter, high-frequency clocks. Implement clock gating techniques to reduce dynamic power consumption by disabling clocks to inactive logic blocks.

5. Design for Testability:

Incorporate design for testability (DFT) techniques to simplify testing and debugging. Implement boundary scan (JTAG) to facilitate board-level testing and debugging. Use built-in self-test (BIST) features to validate internal logic functionality.

Considerations:

When designing with 5SGXMB9R3H43C3G, consider:

- Power Supply Decoupling: Use a combination of bulk and high-frequency decoupling capacitors close to the power pins to filter noise effectively.

- PCB Layout: Design the PCB layout to minimize crosstalk and electromagnetic interference (EMI). Use ground planes and proper trace routing techniques to achieve this.

- Heat Dissipation: Ensure that heat generated by the FPGA and surrounding components is effectively dissipated using thermal vias and heatsinks.

- Signal Trace Length Matching: For high-speed differential pairs, ensure the trace lengths are matched to avoid skew and maintain signal integrity.

- Power Budgeting: Estimate the power consumption of the FPGA and design the power supply accordingly to ensure reliable operation under all conditions.

5SGXMB9R3H43C3G FAQ

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The price and inventory of 5SGXMB9R3H43C3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMB9R3H43C3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB9R3H43C3G we delivered, we will accept the replacement or return of the 5SGXMB9R3H43C3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB9R3H43C3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations