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Name: 5SGXMB9R1H43C2N
Brand: Intel
SKU: 5SGXMB9R1H43C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMB9R1H43C2N

Part No.:: 5SGXMB9R1H43C2N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXMB9R1H43C2N.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2904

Quantity:: Add To Cart

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5SGXMB9R1H43C2N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMB9R1H43C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB9R1H43C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB9R1H43C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB9R1H43C2N information

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5SGXMB9R1H43C2N Application Introduction

5SGXMB9R1H43C2N is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering versatile programmable logic capabilities suitable for a wide range of applications, from telecommunications to industrial automation.

Application Scenario:

In the realm of telecommunications, 5SGXMB9R1H43C2N can be utilized to implement complex signal processing algorithms for wireless communication systems, such as 5G base stations.

Design Optimization:

To effectively utilize 5SGXMB9R1H43C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation. Utilize power gating and clock gating strategies to dynamically control power consumption based on the operational requirements of the FPGA.

2. Signal Integrity:

Optimize the PCB layout to minimize signal reflections, crosstalk, and other sources of signal degradation. Utilize impedance matching techniques and proper termination schemes to maintain signal integrity and maximize data transmission rates.

3. Thermal Management:

Deploy effective thermal management solutions to prevent overheating and ensure the longevity of 5SGXMB9R1H43C2N. Incorporate heat sinks, thermal vias, and proper airflow designs to dissipate heat efficiently and maintain optimal operating temperatures.

4. Clock Distribution:

Optimize the clock distribution network to minimize clock skew and jitter, ensuring synchronous operation of the FPGA and associated components. Utilize PLLs (Phase-Locked Loops) and clock conditioning circuits to generate stable clock signals with precise timing characteristics.

5. Design Partitioning:

Break down the design into manageable modules and utilize hierarchical design techniques to simplify development and improve design scalability. Implement proper communication interfaces between modules to facilitate efficient data exchange and coordination.

Considerations:

When optimizing the design using 5SGXMB9R1H43C2N, it's essential to consider:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic elements and memory blocks, to minimize resource wastage and maximize design flexibility.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets timing constraints and achieves reliable operation at the desired clock frequencies.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property and ensure the integrity of the FPGA configuration.

- Verification and Testing: Conduct comprehensive verification and testing to validate the functionality, performance, and reliability of the design under various operating conditions and corner cases.

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3. Are the 5SGXMB9R1H43C2N price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXMB9R1H43C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB9R1H43C2N we delivered, we will accept the replacement or return of the 5SGXMB9R1H43C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB9R1H43C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations