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Name: 5SGXMB9R1H43C2LG
Brand: Intel
SKU: 5SGXMB9R1H43C2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMB9R1H43C2LG

Part No.:: 5SGXMB9R1H43C2LG

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 3796

Quantity:: Add To Cart

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5SGXMB9R1H43C2LG Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMB9R1H43C2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB9R1H43C2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB9R1H43C2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB9R1H43C2LG information

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The working principle and core technical features of 5SGXMB9R1H43C2LG

5SGXMB9R1H43C2LG is a high-performance FPGA chip designed by Altera (now part of Intel), offering advanced features and capabilities for various applications. This chip is known for its high logic density, versatile I/O options, and robust architecture, making it suitable for demanding computing tasks.

Application Scenario:

In telecommunications, 5SGXMB9R1H43C2LG can be utilized to manage high-speed data processing and signal transmission, ensuring reliable and efficient communication in networking equipment.

Core Technology Features:

1. High Logic Density:

5SGXMB9R1H43C2LG boasts a significant number of logic elements, enabling complex designs and large-scale integration. This high density allows for more functionality within a single chip, reducing the need for multiple components and simplifying circuit design.

2. Advanced I/O Options:

The chip offers a wide range of I/O standards, supporting high-speed interfaces like PCIe, DDR3, and Ethernet. These options ensure compatibility with various peripherals and systems, facilitating seamless integration into existing infrastructure.

3. Robust Architecture:

The architecture of 5SGXMB9R1H43C2LG is designed to provide high reliability and performance. Features like error correction, redundancy, and power management contribute to its robust operation in critical applications.

4. High-Speed Transceivers:

The inclusion of high-speed transceivers in 5SGXMB9R1H43C2LG enables efficient data transfer between the FPGA and other devices. These transceivers support data rates up to several gigabits per second, making the chip ideal for bandwidth-intensive applications.

5. Flexible Configuration:

This chip supports flexible configuration options, including partial reconfiguration, allowing for dynamic updates and adjustments without interrupting the system's operation. This feature is particularly useful in adaptive computing environments.

Application Example - Network Equipment:

1. Data Processing:

In a network router, 5SGXMB9R1H43C2LG can be employed to handle data packets, perform routing algorithms, and manage traffic efficiently. Its high logic density and processing capability ensure low latency and high throughput.

2. Signal Integrity:

With advanced I/O and high-speed transceivers, this chip ensures signal integrity and reduces transmission errors. This is crucial for maintaining data accuracy and reliability in communication systems.

3. Power Efficiency:

The robust architecture and power management features of 5SGXMB9R1H43C2LG contribute to its energy efficiency, reducing operational costs and thermal challenges in densely packed network equipment.

4. Scalability:

The flexible configuration options allow network equipment designers to scale their systems efficiently, adding or updating functionalities as needed without significant hardware changes. This adaptability ensures future-proofing of the equipment.

Considerations:

When utilizing this chip in design, consider the following:

- Thermal Management: Implement effective cooling solutions to manage the heat generated by the high logic density and processing power.

- Signal Integrity: Design with proper layout and grounding techniques to maintain signal integrity at high data rates.

- Power Supply: Ensure stable and clean power supply to support the chip's operation and connected peripherals.

- Firmware Optimization: Develop efficient firmware to leverage the chip's capabilities and optimize overall system performance.

- Compliance: Ensure the design meets relevant industry standards and regulations for electromagnetic compatibility and safety.

5SGXMB9R1H43C2LG FAQ

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3. Are the 5SGXMB9R1H43C2LG price and inventory displayed accurate?

The price and inventory of 5SGXMB9R1H43C2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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5. How is the shipping arranged?

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMB9R1H43C2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB9R1H43C2LG we delivered, we will accept the replacement or return of the 5SGXMB9R1H43C2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB9R1H43C2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations