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Name: 5SGXMB6R2F43I2LN
Brand: Intel
SKU: 5SGXMB6R2F43I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMB6R2F43I2LN

Part No.:: 5SGXMB6R2F43I2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXMB6R2F43I2LN.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 2280

Quantity:: Add To Cart

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5SGXMB6R2F43I2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMB6R2F43I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB6R2F43I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB6R2F43I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB6R2F43I2LN information

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5SGXMB6R2F43I2LN Application Introduction

5SGXMB6R2F43I2LN is a high-density FPGA device designed by Intel, offering advanced processing capabilities and extensive resources for complex digital designs.

Application Overview:

In the realm of digital signal processing (DSP), 5SGXMB6R2F43I2LN can be effectively utilized for applications such as real-time image processing, telecommunications, and radar systems.

Design Optimization:

To maximize the potential of 5SGXMB6R2F43I2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal utilization of 5SGXMB6R2F43I2LN's resources while minimizing power consumption. Utilize dynamic power modes and voltage scaling techniques to adapt power usage based on the processing requirements.

2. Signal Integrity:

Design the PCB layout carefully to maintain signal integrity and minimize signal degradation. Employ proper termination techniques, impedance matching, and routing guidelines to mitigate signal integrity issues and ensure reliable data transmission within the FPGA and with external components.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated during operation and prevent thermal-induced performance degradation or reliability issues. Utilize thermal vias, heat sinks, and fans to efficiently dissipate heat and maintain optimal operating temperatures for 5SGXMB6R2F43I2LN.

4. Resource Utilization:

Optimize resource utilization within 5SGXMB6R2F43I2LN by carefully mapping and placing logic elements, memory blocks, and DSP slices to maximize performance and minimize resource wastage. Utilize advanced synthesis and optimization tools provided by Intel to achieve optimal resource utilization and meet design requirements.

5. Clock Management:

Implement robust clock management techniques to ensure reliable clock distribution and synchronization within the FPGA design. Utilize dedicated clock networks, clock constraints, and clock domain crossing methodologies to maintain timing closure and prevent clock-related issues in 5SGXMB6R2F43I2LN designs.

Considerations:

When optimizing the design with 5SGXMB6R2F43I2LN, it's crucial to consider:

- Design Constraints: Understand and adhere to the timing, area, and power constraints specified for 5SGXMB6R2F43I2LN to ensure successful implementation and operation.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to ensure functionality, performance, and reliability before deployment.

- Design Reusability: Design the FPGA project with modularity and reusability in mind to facilitate future iterations, upgrades, and scalability of the system.

- Security Considerations: Implement security features and protocols to protect sensitive data and intellectual property stored or processed within 5SGXMB6R2F43I2LN-based systems against unauthorized access or tampering.

- Design Documentation: Maintain comprehensive documentation detailing the design specifications, implementation details, and optimization techniques employed in the 5SGXMB6R2F43I2LN project for future reference and knowledge sharing.

5SGXMB6R2F43I2LN FAQ

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The price and inventory of 5SGXMB6R2F43I2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMB6R2F43I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB6R2F43I2LN we delivered, we will accept the replacement or return of the 5SGXMB6R2F43I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB6R2F43I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations