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Name: 5SGXMB6R2F40I2LN
Brand: Intel
SKU: 5SGXMB6R2F40I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMB6R2F40I2LN

Part No.:: 5SGXMB6R2F40I2LN

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXMB6R2F40I2LN.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 3201

Quantity:: Add To Cart

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5SGXMB6R2F40I2LN Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMB6R2F40I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB6R2F40I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB6R2F40I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB6R2F40I2LN information

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5SGXMB6R2F40I2LN Application Introduction

5SGXMB6R2F40I2LN is an FPGA (Field-Programmable Gate Array) device known for its high performance and versatility in various design projects. When effectively utilized, it can significantly enhance the functionality and efficiency of the designed system.

Power Management:

To optimize power consumption in a design utilizing 5SGXMB6R2F40I2LN, consider implementing power gating techniques to selectively power down unused modules or regions within the FPGA. Utilize low-power design strategies such as clock gating and voltage scaling to minimize power consumption during idle or low activity periods.

Signal Integrity:

Ensuring signal integrity is crucial for reliable operation in FPGA-based designs. Utilize proper PCB layout techniques, such as impedance matching and signal routing guidelines, to minimize signal reflections and crosstalk. Incorporate termination resistors and signal conditioning circuits to maintain signal integrity, especially in high-speed interfaces and long trace lengths.

Thermal Management:

Effective thermal management is essential to prevent overheating and ensure the longevity of 5SGXMB6R2F40I2LN in the design. Implement adequate heat sinking solutions, such as heat spreaders or heat pipes, to dissipate heat generated during operation. Monitor the temperature of the FPGA using onboard sensors or external thermal monitoring circuits and implement dynamic thermal management techniques, such as throttling or clock frequency adjustments, to mitigate thermal issues.

Resource Utilization:

Optimize resource utilization within 5SGXMB6R2F40I2LN by efficiently mapping design logic onto FPGA resources. Utilize vendor-specific synthesis and optimization tools to minimize logic duplication and maximize resource utilization. Explore hierarchical design methodologies and IP core reuse to streamline design implementation and reduce resource overhead.

Design Security:

Ensure design security by implementing encryption and authentication mechanisms to protect the intellectual property (IP) embedded within 5SGXMB6R2F40I2LN-based designs. Utilize secure boot mechanisms and tamper-resistant features to prevent unauthorized access and mitigate potential security threats.

Considerations:

When designing with 5SGXMB6R2F40I2LN, it's essential to consider:

- Design Constraints: Understand the limitations and constraints of the FPGA device, including available resources, maximum operating frequency, and I/O capabilities, to optimize design performance and functionality.

- Design Validation: Perform thorough functional verification and simulation testing to validate the correctness and reliability of the design before deployment. Utilize built-in self-test (BIST) features and external test equipment to ensure proper functionality under various operating conditions.

- Design Iteration: Iterate the design process to refine and improve the design implementation based on feedback and performance analysis. Utilize design exploration techniques and performance profiling tools to identify areas for optimization and enhancement.

- Documentation and Collaboration: Maintain comprehensive documentation of the design specifications, implementation details, and testing procedures to facilitate collaboration and knowledge transfer among team members. Utilize version control systems and collaborative design platforms to manage design revisions and ensure consistency across the design workflow.

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6. What is the process for return or replacement of 5SGXMB6R2F40I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB6R2F40I2LN we delivered, we will accept the replacement or return of the 5SGXMB6R2F40I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB6R2F40I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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