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Name: 5SGXMB6R1F43C2N
Brand: Intel
SKU: 5SGXMB6R1F43C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMB6R1F43C2N

Part No.:: 5SGXMB6R1F43C2N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXMB6R1F43C2N.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 3138

Quantity:: Add To Cart

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5SGXMB6R1F43C2N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMB6R1F43C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB6R1F43C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB6R1F43C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB6R1F43C2N information

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5SGXMB6R1F43C2N Application Introduction

5SGXMB6R1F43C2N is a high-capacity FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering extensive programmable logic resources and advanced features for diverse applications in digital design projects.

Application Scenario:

In a digital signal processing application, 5SGXMB6R1F43C2N can be utilized to implement complex algorithms for tasks such as image processing or audio filtering in real-time.

Circuit Design:

To effectively integrate 5SGXMB6R1F43C2N into a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation. Utilize power gating, clock gating, and dynamic voltage scaling strategies to optimize power usage based on the operational requirements of 5SGXMB6R1F43C2N and its associated peripherals.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as signal crosstalk, reflections, and jitter. Properly terminate high-speed signal lines and use impedance-controlled traces to maintain signal integrity and maximize the performance of 5SGXMB6R1F43C2N.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating and ensure the longevity of 5SGXMB6R1F43C2N. Use thermal vias, heat sinks, and proper airflow in the system enclosure to dissipate heat efficiently and maintain the operating temperature within safe limits.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and reliable clock signals are delivered to 5SGXMB6R1F43C2N and synchronize its internal logic effectively. Use low-jitter clock sources, minimize clock skew, and implement proper clock tree synthesis techniques to optimize timing performance and minimize setup and hold time violations.

5. I/O Optimization:

Optimize the utilization of I/O resources on 5SGXMB6R1F43C2N by carefully planning the placement and routing of external interfaces. Group related I/O signals together, use differential signaling for high-speed interfaces, and implement appropriate termination schemes to maximize signal integrity and minimize electromagnetic interference.

Considerations:

When designing with 5SGXMB6R1F43C2N, it's essential to consider:

- Resource Utilization: Efficiently utilize the programmable logic resources and memory blocks available in 5SGXMB6R1F43C2N to meet the performance and functionality requirements of the design.

- Design Partitioning: Divide the design into manageable partitions and use hierarchical design techniques to simplify the development process and improve design scalability and maintainability.

- Verification and Validation: Thoroughly verify the design through simulation, emulation, and prototyping to identify and address any functional or timing issues before deploying 5SGXMB6R1F43C2N in the target application.

- Design for Testability: Incorporate built-in self-test (BIST) and boundary scan test features into the design to facilitate testing and debugging of 5SGXMB6R1F43C2N-based systems during manufacturing and in-field operation.

- Documentation and Collaboration: Maintain comprehensive documentation throughout the design process to facilitate collaboration among team members and ensure smooth project execution and knowledge transfer.

5SGXMB6R1F43C2N FAQ

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3. Are the 5SGXMB6R1F43C2N price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXMB6R1F43C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB6R1F43C2N we delivered, we will accept the replacement or return of the 5SGXMB6R1F43C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB6R1F43C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations