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Name: 5SGXMB6R1F40C2LN
Brand: Intel
SKU: 5SGXMB6R1F40C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMB6R1F40C2LN

Part No.:: 5SGXMB6R1F40C2LN

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:: 5SGXMB6R1F40C2LN.pdf

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2303

Quantity:: Add To Cart

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5SGXMB6R1F40C2LN Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMB6R1F40C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB6R1F40C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB6R1F40C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB6R1F40C2LN information

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5SGXMB6R1F40C2LN Application Introduction

5SGXMB6R1F40C2LN is a high-capacity field-programmable gate array (FPGA) designed by Intel for demanding applications in various industries, including telecommunications, aerospace, and high-performance computing.

Application Scope:

In telecommunications, 5SGXMB6R1F40C2LN can be utilized for implementing advanced signal processing algorithms, such as those required for 5G wireless communication systems.

Design Strategy:

When incorporating 5SGXMB6R1F40C2LN into a project, the following strategies can be employed for optimal performance:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation of 5SGXMB6R1F40C2LN and associated peripherals. Utilize power gating, dynamic voltage and frequency scaling (DVFS), and intelligent clock gating to optimize power usage.

2. Signal Integrity:

Pay careful attention to signal integrity considerations to prevent signal degradation and ensure reliable communication between components. Use proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity, especially in high-speed interfaces like DDR memory and PCIe.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXMB6R1F40C2LN during operation. Utilize heatsinks, fans, or thermal vias in the PCB layout to efficiently transfer heat away from the FPGA and prevent overheating, which can degrade performance and reliability.

4. Resource Utilization:

Optimize resource utilization within 5SGXMB6R1F40C2LN to maximize the efficiency of FPGA resources, such as logic elements (LEs), memory blocks, and DSP blocks. Utilize synthesis and place-and-route optimization techniques to minimize logic area usage and reduce routing congestion, enhancing overall performance and timing closure.

5. Design Validation:

Perform comprehensive design validation and testing to verify the functionality, performance, and reliability of the system implemented with 5SGXMB6R1F40C2LN. Use simulation tools, such as ModelSim or Questa, to simulate design behavior and identify potential issues early in the development cycle. Conduct thorough functional testing and timing analysis to ensure compliance with design requirements and performance targets.

Considerations:

When designing with 5SGXMB6R1F40C2LN, it's crucial to consider:

- Design Constraints: Adhere to timing, area, and power constraints specified by the FPGA datasheet and design requirements to achieve optimal performance and reliability.

- Design Partitioning: Divide the design into manageable partitions and utilize hierarchical design techniques to facilitate design reuse, ease of maintenance, and scalability.

- Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and secure the FPGA configuration from unauthorized access or tampering.

- Design Iteration: Iterate the design process iteratively, incorporating feedback from simulation, synthesis, and physical implementation to refine the design and address any issues encountered.

5SGXMB6R1F40C2LN FAQ

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3. Are the 5SGXMB6R1F40C2LN price and inventory displayed accurate?

The price and inventory of 5SGXMB6R1F40C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMB6R1F40C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB6R1F40C2LN we delivered, we will accept the replacement or return of the 5SGXMB6R1F40C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB6R1F40C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations