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Name: 5SGXMB5R3F43C3N
Brand: Intel
SKU: 5SGXMB5R3F43C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMB5R3F43C3N

Part No.:: 5SGXMB5R3F43C3N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXMB5R3F43C3N.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 2888

Quantity:: Add To Cart

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5SGXMB5R3F43C3N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMB5R3F43C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB5R3F43C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB5R3F43C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB5R3F43C3N information

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5SGXMB5R3F43C3N Application Introduction

5SGXMB5R3F43C3N is a high-density and high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel. It offers abundant resources, including logic elements, memory blocks, and transceivers, making it suitable for a wide range of applications in industries such as telecommunications, aerospace, and automotive.

Application Scenario:

In telecommunications infrastructure, 5SGXMB5R3F43C3N can be utilized to implement complex signal processing algorithms, such as modulation/demodulation, error correction, and encryption/decryption, in high-speed communication systems.

Design Optimization:

To effectively utilize 5SGXMB5R3F43C3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation. Utilize the advanced power-saving features offered by 5SGXMB5R3F43C3N, such as dynamic power management modes and clock gating, to dynamically adjust power usage based on the system workload.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout and utilizing proper termination techniques. Pay attention to high-speed signal routing, clock distribution, and impedance matching to minimize signal reflections, crosstalk, and jitter, thus ensuring reliable data transmission.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure device reliability. Employ thermal vias, heat sinks, and fans to dissipate heat generated by 5SGXMB5R3F43C3N and surrounding components. Conduct thermal analysis to identify hotspots and optimize airflow within the system.

4. Design Partitioning:

Break down the design into manageable partitions and utilize the hierarchical design approach to maximize design efficiency and maintainability. Distribute tasks across different FPGA regions to leverage the parallel processing capabilities of 5SGXMB5R3F43C3N and optimize resource utilization.

5. Design Verification:

Thoroughly verify the design through simulation, emulation, and prototyping to ensure functionality, performance, and reliability. Perform timing analysis, functional verification, and stress testing to identify and address potential design issues early in the development cycle.

Considerations:

When designing with 5SGXMB5R3F43C3N, it's essential to consider:

- Resource Utilization: Optimize the utilization of logic elements, memory blocks, and transceivers to minimize resource wastage and maximize design efficiency.

- Timing Closure: Pay close attention to timing constraints and perform timing-driven synthesis and placement to ensure timing closure and meet design performance requirements.

- Design Security: Implement security features such as bitstream encryption and authentication to protect the intellectual property and ensure the integrity of the FPGA configuration.

- Design Scalability: Design the system with scalability in mind to accommodate future expansion and upgrades without requiring significant redesign effort.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC), to facilitate product certification and market acceptance.

5SGXMB5R3F43C3N FAQ

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3. Are the 5SGXMB5R3F43C3N price and inventory displayed accurate?

The price and inventory of 5SGXMB5R3F43C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMB5R3F43C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB5R3F43C3N we delivered, we will accept the replacement or return of the 5SGXMB5R3F43C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB5R3F43C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations