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Name: 5SGXMB5R3F40I3G
Brand: Intel
SKU: 5SGXMB5R3F40I3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMB5R3F40I3G

Part No.:: 5SGXMB5R3F40I3G

Manufacturer:: Intel

Package:: 1517-FBGA (40x40)

Datasheet:

Description:: IC FPGA 432 I/O 1517FBGA

In Stock:: 2375

Quantity:: Add To Cart

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5SGXMB5R3F40I3G Specifications

Package/Case:
1517-FBGA (40x40)
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
41984000
NumberofI/O:
432
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMB5R3F40I3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMB5R3F40I3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMB5R3F40I3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMB5R3F40I3G information

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5SGXMB5R3F40I3G Application Introduction

5SGXMB5R3F40I3G is a high-performance FPGA chip used in a variety of applications requiring robust processing capabilities. It features advanced power management, signal integrity, and thermal management options to ensure optimal operation.

Application Scenario:

In telecommunications, 5SGXMB5R3F40I3G can be employed to manage high-speed data transmission and processing, providing reliable performance in demanding environments.

Circuit Design:

To design a telecommunications system using 5SGXMB5R3F40I3G, follow these steps:

1. Power Management:

Implement efficient power management by using low-dropout (LDO) regulators and switching regulators to provide stable voltage levels. Decoupling capacitors should be placed near power pins to filter out noise and ensure smooth operation.

2. Signal Integrity:

Ensure signal integrity by using proper trace routing techniques. Keep high-speed signal traces short and minimize the use of vias. Differential pairs should be routed together with controlled impedance to reduce signal loss and crosstalk.

3. Thermal Management:

Adequate thermal management is crucial for 5SGXMB5R3F40I3G. Use heat sinks, thermal vias, and proper airflow design to dissipate heat effectively. Thermal simulations can help predict and mitigate hot spots on the board.

4. FPGA Configuration:

Configure this chip using the appropriate configuration method, such as JTAG or flash memory. Ensure that the configuration interface is reliable and protected from external interference.

5. PCB Layout:

Design the PCB layout with attention to detail. Place decoupling capacitors close to the power supply pins of this chip. Ensure that ground and power planes are solid and continuous to reduce impedance and improve performance.

Considerations:

When designing with this chip, it's essential to consider:

- Power Distribution Network (PDN): Design a robust PDN to handle the power requirements and reduce voltage drops across the board.

- Electromagnetic Compatibility (EMC): Design for EMC compliance by using shielding, filtering, and careful layout practices to minimize electromagnetic interference.

- Signal Integrity Testing: Use tools like oscilloscopes and network analyzers to test and verify the signal integrity of high-speed signals.

- Heat Dissipation: Regularly monitor the thermal performance of the system and make adjustments to the cooling solution as needed.

- Redundancy and Reliability: Implement redundancy and fail-safe mechanisms to ensure system reliability in critical applications.

5SGXMB5R3F40I3G FAQ

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3. Are the 5SGXMB5R3F40I3G price and inventory displayed accurate?

The price and inventory of 5SGXMB5R3F40I3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMB5R3F40I3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMB5R3F40I3G we delivered, we will accept the replacement or return of the 5SGXMB5R3F40I3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMB5R3F40I3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations