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Name: 5SGXMABN2F45C3N
Brand: Intel
SKU: 5SGXMABN2F45C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMABN2F45C3N

Part No.:: 5SGXMABN2F45C3N

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXMABN2F45C3N.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2636

Quantity:: Add To Cart

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5SGXMABN2F45C3N Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMABN2F45C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMABN2F45C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMABN2F45C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMABN2F45C3N information

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5SGXMABN2F45C3N Application Introduction

5SGXMABN2F45C3N is a field-programmable gate array (FPGA) device manufactured by Intel, offering high performance and flexibility for various digital design projects.

Application Scenario:

In the field of telecommunications, 5SGXMABN2F45C3N can be utilized to implement signal processing algorithms for efficient data transmission and reception in wireless communication systems.

Circuit Design:

To effectively integrate 5SGXMABN2F45C3N into a digital design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management strategies to ensure optimal power utilization and prolong the battery life of portable devices. Utilize power gating techniques and dynamic voltage and frequency scaling (DVFS) to minimize power consumption during idle and low-load conditions.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and ensure reliable data transmission between the FPGA and external components. Pay attention to signal routing, impedance matching, and proper termination to maintain signal integrity and reduce the risk of timing violations.

3. Thermal Management:

Prevent overheating of the 5SGXMABN2F45C3N FPGA by incorporating adequate thermal dissipation mechanisms, such as heatsinks, fans, or thermal vias. Ensure proper airflow within the system enclosure and monitor the temperature using on-chip thermal sensors to prevent thermal throttling and ensure long-term reliability.

4. Design Partitioning:

Partition the design into logical modules and utilize the resources of 5SGXMABN2F45C3N efficiently to minimize resource utilization and optimize performance. Implement parallel processing and pipelining techniques to maximize throughput and reduce latency in data-intensive applications.

5. Clock Management:

Generate and distribute clock signals effectively within the FPGA design to synchronize the operation of different modules and meet timing constraints. Utilize advanced clocking resources, such as phase-locked loops (PLLs) and clock networks, to optimize clock distribution and minimize clock skew.

Considerations:

When designing with 5SGXMABN2F45C3N, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to achieve the desired functionality within the available constraints.

- Design Flexibility: Leverage the reconfigurability of the FPGA to adapt the design to changing requirements and implement future enhancements through partial reconfiguration or firmware updates.

- Timing Closure: Perform thorough timing analysis and constraint-driven synthesis to ensure that the design meets timing requirements and achieves the desired performance targets.

- Debugging and Validation: Implement built-in self-test (BIST) and debugging features within the FPGA design to facilitate rapid prototyping, testing, and debugging of the system functionality.

- Security Considerations: Incorporate security features, such as encryption, authentication, and secure booting, to protect sensitive data and intellectual property stored within the FPGA from unauthorized access and tampering.

5SGXMABN2F45C3N FAQ

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3. Are the 5SGXMABN2F45C3N price and inventory displayed accurate?

The price and inventory of 5SGXMABN2F45C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMABN2F45C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMABN2F45C3N we delivered, we will accept the replacement or return of the 5SGXMABN2F45C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMABN2F45C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations