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Name: 5SGXMA9N2F45C3N
Brand: Intel
SKU: 5SGXMA9N2F45C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA9N2F45C3N

Part No.:: 5SGXMA9N2F45C3N

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 5SGXMA9N2F45C3N.pdf

Description:: IC FPGA 840 I/O 1932FBGA

In Stock:: 2739

Quantity:: Add To Cart

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5SGXMA9N2F45C3N Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
840
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA9N2F45C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA9N2F45C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA9N2F45C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA9N2F45C3N information

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5SGXMA9N2F45C3N Application Introduction

5SGXMA9N2F45C3N is a high-performance FPGA (Field-Programmable Gate Array) device commonly utilized in complex digital design projects, offering a wide range of features and capabilities.

Application Scope:

In digital signal processing applications, 5SGXMA9N2F45C3N can be employed to implement sophisticated algorithms for tasks such as image processing, telecommunications, and audio processing.

Circuit Design:

To effectively utilize 5SGXMA9N2F45C3N in a digital design project, consider the following steps:

1. Power Management:

Implement efficient power supply and management strategies to ensure stable and reliable operation of 5SGXMA9N2F45C3N and associated components. Utilize voltage regulators, decoupling capacitors, and power sequencing techniques to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and transmission line effects. Utilize impedance matching techniques, proper termination, and signal integrity analysis tools to maintain signal integrity and reliability.

3. Thermal Management:

Implement effective thermal management solutions to prevent 5SGXMA9N2F45C3N from overheating and ensure reliable long-term operation. Use thermal vias, heatsinks, fans, and thermal simulation tools to optimize thermal performance and maintain the FPGA within safe operating temperatures.

4. Design Optimization:

Optimize the design for resource utilization, performance, and power consumption. Utilize advanced synthesis and optimization techniques, such as pipelining, parallel processing, and resource sharing, to maximize the efficiency of 5SGXMA9N2F45C3N and meet design requirements.

5. Design for Testability:

Include built-in self-test (BIST) circuits, debug interfaces, and monitoring features to facilitate testing, debugging, and validation of the FPGA design. Implement comprehensive testing procedures to ensure the functionality, reliability, and performance of the design.

Considerations:

When designing with 5SGXMA9N2F45C3N, consider the following factors:

- Design Constraints: Understand and adhere to the timing, area, and power constraints of the FPGA device to avoid timing violations, resource conflicts, and excessive power consumption.

- High-Speed Interfaces: Properly interface with high-speed serial transceivers, DDR memory interfaces, and other external peripherals to ensure reliable data transmission and high-speed communication.

- Security: Implement security features, such as encryption, authentication, and tamper detection mechanisms, to protect sensitive data and intellectual property stored or processed by the FPGA design.

- Design Reusability: Modularize the design, use IP cores, and adopt standard interfaces to promote design reusability, scalability, and flexibility for future projects and iterations.

- Compliance: Ensure compliance with industry standards, such as RoHS, CE, and FCC, as well as specific application requirements and regulations relevant to the intended market or industry sector.

5SGXMA9N2F45C3N FAQ

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3. Are the 5SGXMA9N2F45C3N price and inventory displayed accurate?

The price and inventory of 5SGXMA9N2F45C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA9N2F45C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA9N2F45C3N we delivered, we will accept the replacement or return of the 5SGXMA9N2F45C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA9N2F45C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations