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Name: 5SGXMA7H3F35C3N
Brand: Intel
SKU: 5SGXMA7H3F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA7H3F35C3N

Part No.:: 5SGXMA7H3F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA7H3F35C3N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3843

Quantity:: Add To Cart

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5SGXMA7H3F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA7H3F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA7H3F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA7H3F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA7H3F35C3N information

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5SGXMA7H3F35C3N Application Introduction

5SGXMA7H3F35C3N is a high-performance FPGA (Field Programmable Gate Array) device manufactured by Intel, offering versatile capabilities for a wide range of applications, including telecommunications, automotive, and aerospace industries.

Application Scenario:

In telecommunications infrastructure, 5SGXMA7H3F35C3N can be utilized to implement high-speed data processing, encryption, and signal modulation functionalities, enhancing the performance and reliability of network equipment.

Circuit Design:

To effectively utilize 5SGXMA7H3F35C3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage and current levels for 5SGXMA7H3F35C3N and its associated components. Utilize low-dropout regulators (LDOs) and power sequencing circuits to minimize power noise and optimize energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion, crosstalk, and reflections. Utilize impedance matching techniques, controlled impedance traces, and proper grounding strategies to maintain signal integrity and prevent data errors or communication failures.

3. Thermal Management:

Ensure effective heat dissipation to prevent 5SGXMA7H3F35C3N from overheating and ensure reliable operation. Use thermal vias, heat sinks, and fans to dissipate heat efficiently and maintain the device within the specified temperature range.

4. Clock Distribution:

Optimize clock distribution networks to minimize clock skew and jitter, ensuring accurate timing synchronization and high-speed data processing. Use dedicated clock routing layers, clock buffers, and phase-locked loops (PLLs) to generate stable clock signals with minimal skew.

5. Design Verification:

Conduct thorough simulations, functional testing, and prototyping to verify the performance, reliability, and compliance of the design with the specified requirements. Utilize FPGA design tools, such as Quartus Prime, to optimize resource utilization, timing constraints, and power consumption.

Considerations:

When designing with 5SGXMA7H3F35C3N, it's essential to consider:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize design efficiency and minimize costs.

- High-Speed Interfaces: Implement high-speed serial interfaces, such as PCIe, Gigabit Ethernet, and DDR memory interfaces, with proper signal integrity and timing constraints to achieve optimal data throughput and system performance.

- Security: Incorporate security features, such as encryption algorithms and secure boot mechanisms, to protect sensitive data and intellectual property stored or processed by 5SGXMA7H3F35C3N.

- Design Reusability: Modularize the design to facilitate future scalability, maintenance, and reuse of intellectual property (IP) cores, reducing time-to-market and development costs for future projects.

- Compliance: Ensure compliance with industry standards, such as PCI Express, JESD204B, and AES encryption standards, to facilitate interoperability and certification of the final product in the target market.

5SGXMA7H3F35C3N FAQ

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3. Are the 5SGXMA7H3F35C3N price and inventory displayed accurate?

The price and inventory of 5SGXMA7H3F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA7H3F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA7H3F35C3N we delivered, we will accept the replacement or return of the 5SGXMA7H3F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA7H3F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations