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Name: 5SGXMA7H3F35C2LN
Brand: Intel
SKU: 5SGXMA7H3F35C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA7H3F35C2LN

Part No.:: 5SGXMA7H3F35C2LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA7H3F35C2LN.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3979

Quantity:: Add To Cart

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5SGXMA7H3F35C2LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA7H3F35C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA7H3F35C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA7H3F35C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA7H3F35C2LN information

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5SGXMA7H3F35C2LN Application Introduction

5SGXMA7H3F35C2LN is a powerful FPGA device from Intel, offering high performance and versatility for a wide range of applications, including digital signal processing, communications, and industrial automation.

Application Scenario:

In a digital signal processing application, 5SGXMA7H3F35C2LN can be utilized to implement complex algorithms for audio processing or image recognition tasks.

Circuit Design:

To effectively utilize 5SGXMA7H3F35C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure stable operation. Utilize power gating and dynamic voltage scaling strategies to optimize power usage in different operating modes of 5SGXMA7H3F35C2LN.

2. Signal Integrity:

Ensure signal integrity by carefully designing high-speed signal traces and minimizing signal reflections and crosstalk. Use impedance-matched transmission lines and properly terminated connections to maintain signal integrity, especially in interfaces like DDR memory and high-speed serial links in 5SGXMA7H3F35C2LN.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating and ensure reliable operation of 5SGXMA7H3F35C2LN. Utilize heat sinks, thermal vias, and proper airflow in the system enclosure to dissipate heat generated by the FPGA device and other heat-producing components.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to the various logic elements within 5SGXMA7H3F35C2LN. Minimize clock skew and jitter by carefully routing clock traces and utilizing clock buffers and phase-locked loops (PLLs) for clock synthesis and distribution.

5. Design Partitioning:

Break down the design into manageable partitions and utilize the hierarchical design methodology to improve design scalability and maintainability. Utilize the hierarchical interconnect features of 5SGXMA7H3F35C2LN to efficiently manage complex designs and optimize resource utilization.

Considerations:

When optimizing the design, consider the following factors:

- Resource Utilization: Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize the efficiency of the design implementation.

- Timing Closure: Ensure timing closure by carefully analyzing and optimizing the timing constraints of the design to meet the required performance specifications.

- Design Debugging: Implement effective debugging techniques, such as signal probing and simulation-based verification, to identify and resolve design issues during the development phase.

- Security Considerations: Implement security features, such as device authentication and encryption, to protect the intellectual property and sensitive data stored within 5SGXMA7H3F35C2LN from unauthorized access or tampering.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as RoHS and CE, when designing and manufacturing products using 5SGXMA7H3F35C2LN to ensure market acceptance and regulatory compliance.

5SGXMA7H3F35C2LN FAQ

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA7H3F35C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA7H3F35C2LN we delivered, we will accept the replacement or return of the 5SGXMA7H3F35C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA7H3F35C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations