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Name: 5SGXMA7H3F35C2
Brand: Intel
SKU: 5SGXMA7H3F35C2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA7H3F35C2

Part No.:: 5SGXMA7H3F35C2

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA7H3F35C2.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2638

Quantity:: Add To Cart

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5SGXMA7H3F35C2 Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA7H3F35C2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA7H3F35C2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA7H3F35C2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA7H3F35C2 information

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5SGXMA7H3F35C2 Application Introduction

5SGXMA7H3F35C2 is a high-density and high-performance FPGA (Field Programmable Gate Array) device, widely used in demanding applications such as telecommunications, aerospace, and high-performance computing.

Application Scenario:

In telecommunications, 5SGXMA7H3F35C2 can be utilized for implementing complex signal processing algorithms, such as in baseband processing for 5G wireless communication systems.

Design Optimization:

To effectively utilize 5SGXMA7H3F35C2 in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 5SGXMA7H3F35C2. Utilize advanced power-saving modes and dynamic voltage scaling techniques to optimize power usage during different operating conditions.

2. Signal Integrity:

Pay special attention to signal integrity to ensure reliable data transmission within the FPGA and with external components. Proper PCB layout techniques, such as controlled impedance traces and signal termination, are crucial to maintain signal integrity, especially for high-speed interfaces.

3. Thermal Management:

Manage the thermal performance of 5SGXMA7H3F35C2 to prevent overheating and ensure long-term reliability. Incorporate adequate heat sinks, thermal vias, and airflow within the system design to dissipate heat effectively. Utilize thermal simulation tools to optimize the placement of critical components and mitigate hotspots.

4. Timing Closure:

Ensure timing closure by properly managing clock domains, minimizing clock skew, and optimizing routing delays. Utilize advanced synthesis and place-and-route optimization techniques to meet timing constraints and maximize the operating frequency of 5SGXMA7H3F35C2.

5. Resource Utilization:

Optimize resource utilization by efficiently mapping the design onto 5SGXMA7H3F35C2 resources, such as logic elements, DSP blocks, and memory resources. Utilize FPGA-specific optimization tools and techniques, such as pipelining, resource sharing, and parallel processing, to maximize performance and minimize resource usage.

Considerations:

When designing with 5SGXMA7H3F35C2, keep in mind the following considerations:

- Design Constraints: Define and adhere to design constraints, such as timing, area, and power constraints, throughout the design process to ensure optimal performance and reliability.

- Design Validation: Perform thorough design validation and verification using simulation, emulation, and hardware testing techniques to identify and correct potential design flaws and ensure functional correctness.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and confidentiality of the FPGA design against unauthorized access and tampering.

- Design Reusability: Design the FPGA system with modularity and reusability in mind to facilitate future design iterations, upgrades, and scalability.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as FCC regulations for electromagnetic interference (EMI) and safety standards, to facilitate market acceptance and regulatory approval of the final product.

5SGXMA7H3F35C2 FAQ

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3. Are the 5SGXMA7H3F35C2 price and inventory displayed accurate?

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA7H3F35C2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA7H3F35C2 we delivered, we will accept the replacement or return of the 5SGXMA7H3F35C2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA7H3F35C2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations