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Name: 5SGXMA7H2F35I3G
Brand: Intel
SKU: 5SGXMA7H2F35I3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA7H2F35I3G

Part No.:: 5SGXMA7H2F35I3G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2915

Quantity:: Add To Cart

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5SGXMA7H2F35I3G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMA7H2F35I3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA7H2F35I3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA7H2F35I3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA7H2F35I3G information

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5SGXMA7H2F35I3G Application Introduction

5SGXMA7H2F35I3G is an advanced FPGA (Field-Programmable Gate Array) suitable for high-performance applications requiring efficient power management, signal integrity, and thermal management.

Application Scenario:

In telecommunications, this FPGA can be used for high-speed data processing, network security applications, and advanced signal processing tasks.

Circuit Design:

To design a robust system using 5SGXMA7H2F35I3G, consider the following steps:

1. Power Management:

Proper power supply design is crucial. Use low-noise linear regulators and switching regulators to provide clean and stable power to the FPGA. Implement multiple power domains to separate analog and digital circuitry, reducing noise interference. Decoupling capacitors should be placed close to the power pins of 5SGXMA7H2F35I3G to filter out high-frequency noise.

2. Signal Integrity:

Maintain signal integrity by designing with controlled impedance traces for high-speed signals. Use differential pairs for signals like LVDS to minimize noise and crosstalk. Ensure proper termination and avoid stubs to prevent signal reflections. Route critical signals first, and keep them as short and direct as possible.

3. Thermal Management:

Effective thermal management is essential to ensure reliable operation. Use heatsinks, fans, and thermal vias to dissipate heat generated by 5SGXMA7H2F35I3G. Thermal simulation tools can help in predicting hot spots and optimizing the thermal design. Ensure proper airflow within the enclosure and consider the placement of heat-sensitive components.

4. PCB Layout:

A well-designed PCB layout can enhance the performance and reliability of the FPGA. Use multi-layer boards to separate power and ground planes, reducing noise and improving signal integrity. Place critical components, such as power supplies and decoupling capacitors, close to the FPGA. Minimize the length of high-speed signal traces and use appropriate grounding techniques.

5. Programming and Configuration:

Utilize the FPGA's configuration options effectively. Use JTAG or other supported interfaces for programming 5SGXMA7H2F35I3G. Ensure proper configuration memory and redundancy for reliable operation. Use design tools to optimize the logic and resource utilization within the FPGA, considering power and performance trade-offs.

Considerations:

When designing with 5SGXMA7H2F35I3G, it is crucial to consider:

- Power Sequencing: Ensure proper power-up and power-down sequencing to avoid damage to the FPGA.

- Signal Routing: Prioritize the routing of high-speed and critical signals to maintain signal integrity and performance.

- Thermal Simulation: Use simulation tools to predict and mitigate thermal issues in the design phase.

- Component Placement: Place components strategically to minimize interference and optimize thermal management.

- Testing and Validation: Thoroughly test the system under various conditions to ensure robustness and reliability.

5SGXMA7H2F35I3G FAQ

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3. Are the 5SGXMA7H2F35I3G price and inventory displayed accurate?

The price and inventory of 5SGXMA7H2F35I3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA7H2F35I3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA7H2F35I3G we delivered, we will accept the replacement or return of the 5SGXMA7H2F35I3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA7H2F35I3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations