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Name: 5SGXMA7H2F35C2
Brand: Intel
SKU: 5SGXMA7H2F35C2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA7H2F35C2

Part No.:: 5SGXMA7H2F35C2

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA7H2F35C2.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 2613

Quantity:: Add To Cart

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5SGXMA7H2F35C2 Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
234720
NumberofLogicElements/Cells:
622000
TotalRAMBits:
51200000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA7H2F35C2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA7H2F35C2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA7H2F35C2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA7H2F35C2 information

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5SGXMA7H2F35C2 Application Introduction

5SGXMA7H2F35C2 is a high-performance FPGA chip commonly used in complex digital design projects, offering a wide range of capabilities for various applications.

Application Scenario:

In digital signal processing (DSP) applications, 5SGXMA7H2F35C2 can be utilized to implement advanced algorithms for audio, image, or video processing, providing high-speed and parallel processing capabilities.

Design Optimization:

To effectively utilize 5SGXMA7H2F35C2 in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power utilization and minimize power consumption of 5SGXMA7H2F35C2 and associated peripherals. Utilize dynamic power modes and voltage scaling techniques to adapt power consumption to workload demands.

2. Signal Integrity:

Design PCB layout and routing carefully to maintain signal integrity and minimize signal distortion or crosstalk. Ensure proper termination techniques and impedance matching for high-speed interfaces connected to 5SGXMA7H2F35C2, such as DDR memory interfaces or high-speed serial links.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of 5SGXMA7H2F35C2 under extended operation. Utilize heatsinks, thermal vias, and fans to dissipate heat efficiently and maintain the FPGA's temperature within safe operating limits.

4. Clock Distribution:

Optimize clock distribution networks to minimize clock skew and jitter, ensuring synchronous operation of all components interfacing with 5SGXMA7H2F35C2. Use clock buffering and fanout techniques to maintain signal integrity and minimize clock skew across the FPGA fabric.

5. Design Security:

Implement design security measures, such as encryption and authentication mechanisms, to protect the intellectual property and prevent unauthorized access or tampering with the 5SGXMA7H2F35C2 configuration bitstream and sensitive data stored within the FPGA.

Considerations:

When optimizing the design using 5SGXMA7H2F35C2, it's essential to consider:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, memory blocks, and DSP slices, to meet performance and resource constraints while minimizing resource wastage.

- Timing Closure: Perform timing analysis and optimization to ensure that the design meets timing requirements and achieves maximum operating frequency without violating setup and hold time constraints.

- Design Reusability: Modularize the design and use hierarchical design methodologies to promote design reuse and facilitate scalability and maintainability of the FPGA design project.

- Testability: Incorporate built-in self-test (BIST) and debug features to facilitate testing and debugging of the FPGA design during development and deployment stages, improving overall design reliability and time-to-market.

5SGXMA7H2F35C2 FAQ

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6. What is the process for return or replacement of 5SGXMA7H2F35C2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA7H2F35C2 we delivered, we will accept the replacement or return of the 5SGXMA7H2F35C2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA7H2F35C2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations