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Name: 5SGXMA5H3F35C3N
Brand: Intel
SKU: 5SGXMA5H3F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA5H3F35C3N

Part No.:: 5SGXMA5H3F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA5H3F35C3N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3740

Quantity:: Add To Cart

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5SGXMA5H3F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA5H3F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA5H3F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA5H3F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA5H3F35C3N information

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5SGXMA5H3F35C3N Application Introduction

5SGXMA5H3F35C3N is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering powerful processing capabilities and versatile programmability for a wide range of applications.

Application Scenario:

In digital signal processing and communication systems, 5SGXMA5H3F35C3N can be utilized to implement complex algorithms, such as digital filters or modulation schemes, with high efficiency and flexibility.

Circuit Design:

To effectively utilize 5SGXMA5H3F35C3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable and clean power delivery to 5SGXMA5H3F35C3N and associated components. Utilize low-dropout voltage regulators and bypass capacitors to minimize voltage fluctuations and noise.

2. Signal Integrity:

Design PCB layouts with proper signal integrity considerations to minimize signal distortion and timing errors. Utilize techniques such as controlled impedance traces, ground/power plane placement, and signal termination to maintain signal integrity in high-speed interfaces and signal pathways involving 5SGXMA5H3F35C3N.

3. Thermal Management:

Ensure effective thermal dissipation for 5SGXMA5H3F35C3N to prevent overheating and maintain reliable operation. Utilize thermal vias, heat sinks, and proper airflow in the system enclosure to dissipate heat generated during FPGA operation.

4. Configuration:

Optimize FPGA configuration strategies to reduce configuration time and enhance system boot-up speed. Utilize configuration compression techniques and efficient configuration protocols, such as JTAG or PCIe-based configuration, to expedite the initialization process of 5SGXMA5H3F35C3N.

5. Resource Utilization:

Maximize resource utilization of 5SGXMA5H3F35C3N by employing efficient logic synthesis and placement strategies. Utilize advanced synthesis directives, such as area constraints and timing constraints, to optimize logic utilization and meet design performance requirements without exceeding FPGA capacity.

Considerations:

When designing with 5SGXMA5H3F35C3N, it's crucial to consider:

- Design Constraints: Understand the specific design constraints and performance targets to optimize resource utilization and achieve desired functionality.

- Timing Closure: Perform thorough timing analysis and optimization to ensure that critical paths meet timing requirements and prevent timing violations.

- Design Validation: Utilize simulation and emulation tools to validate the design functionality and performance before hardware implementation, reducing the risk of errors and ensuring first-pass success.

- Design Modularity: Divide the design into modular components to facilitate reusability, scalability, and easier debugging and maintenance.

- Documentation: Maintain comprehensive documentation of the design process, including design specifications, schematics, and firmware/software source code, to aid in future revisions and troubleshooting.

5SGXMA5H3F35C3N FAQ

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3. Are the 5SGXMA5H3F35C3N price and inventory displayed accurate?

The price and inventory of 5SGXMA5H3F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA5H3F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA5H3F35C3N we delivered, we will accept the replacement or return of the 5SGXMA5H3F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA5H3F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations