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Name: 5SGXMA5H2F35C3N
Brand: Intel
SKU: 5SGXMA5H2F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA5H2F35C3N

Part No.:: 5SGXMA5H2F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA5H2F35C3N.pdf

Description:: IC FPGA 552 I/O 1152FBGA

In Stock:: 3140

Quantity:: Add To Cart

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5SGXMA5H2F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
185000
NumberofLogicElements/Cells:
490000
TotalRAMBits:
46080000
NumberofI/O:
552
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA5H2F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA5H2F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA5H2F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA5H2F35C3N information

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5SGXMA5H2F35C3N Application Introduction

5SGXMA5H2F35C3N is a high-performance FPGA chip manufactured by Intel, offering versatile capabilities for various design projects, including but not limited to digital signal processing, image processing, and communication systems.

Application Scenario:

In a digital communication system, 5SGXMA5H2F35C3N can be utilized to implement complex modulation and demodulation algorithms, error correction coding, and protocol handling for efficient data transmission.

Design Optimization:

To effectively utilize 5SGXMA5H2F35C3N in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power usage and prolong the battery life of portable devices. Utilize low-power modes available in 5SGXMA5H2F35C3N and incorporate power gating strategies to selectively disable unused circuitry.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as reflections, crosstalk, and jitter. Follow recommended guidelines provided by Intel for high-speed interfaces to maintain signal integrity and ensure reliable data transmission.

3. Thermal Management:

Deploy effective thermal management techniques to dissipate heat generated by 5SGXMA5H2F35C3N and prevent overheating. Incorporate heat sinks, thermal vias, and proper airflow within the enclosure to maintain the FPGA's operating temperature within safe limits.

4. Clock Distribution:

Optimize clock distribution within the FPGA design to minimize clock skew and jitter. Utilize dedicated clock networks and PLLs available in 5SGXMA5H2F35C3N to generate stable clock signals with low phase noise for synchronous operation.

5. Resource Utilization:

Maximize resource utilization within 5SGXMA5H2F35C3N by optimizing your design for efficient logic synthesis and placement. Utilize advanced synthesis directives and floorplanning techniques to achieve maximum performance and minimize routing congestion.

Considerations:

When optimizing your design with 5SGXMA5H2F35C3N, keep the following considerations in mind:

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met and achieve reliable operation at the desired clock frequency.

- Resource Sharing: Utilize resource sharing techniques such as multiplexing and time-division to efficiently utilize FPGA resources and reduce overall resource usage.

- Design Partitioning: Divide your design into smaller modules or tasks to facilitate parallel development and simplify integration. Utilize hierarchical design methodologies to manage complexity and improve design scalability.

- Test and Verification: Develop comprehensive test benches and verification strategies to validate the functionality and performance of your design under various operating conditions and corner cases.

- Documentation: Maintain thorough documentation throughout the design process, including design specifications, constraints, and implementation details, to facilitate collaboration and future modifications.

5SGXMA5H2F35C3N FAQ

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3. Are the 5SGXMA5H2F35C3N price and inventory displayed accurate?

The price and inventory of 5SGXMA5H2F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA5H2F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA5H2F35C3N we delivered, we will accept the replacement or return of the 5SGXMA5H2F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA5H2F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations