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Name: 5SGXMA4H3F35C2LN
Brand: Intel
SKU: 5SGXMA4H3F35C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA4H3F35C2LN

Part No.:: 5SGXMA4H3F35C2LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA4H3F35C2LN.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 3000

Quantity:: Add To Cart

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5SGXMA4H3F35C2LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
158500
NumberofLogicElements/Cells:
420000
TotalRAMBits:
37888000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA4H3F35C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA4H3F35C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA4H3F35C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA4H3F35C2LN information

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5SGXMA4H3F35C2LN Application Introduction

5SGXMA4H3F35C2LN is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering exceptional performance and flexibility for a wide range of applications.

Application Scenario:

In digital signal processing applications, 5SGXMA4H3F35C2LN can be utilized for real-time data processing, image and video processing, and implementing complex algorithms such as encryption and decryption.

Circuit Design:

To effectively utilize 5SGXMA4H3F35C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal performance and minimize power consumption. Utilize low-dropout regulators (LDOs) and power gating strategies to achieve power efficiency while meeting the dynamic power requirements of 5SGXMA4H3F35C2LN.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and other signal integrity issues. Use impedance matching techniques and proper termination schemes for high-speed interfaces to maintain signal integrity and reduce jitter.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 5SGXMA4H3F35C2LN during operation. Use heat sinks, thermal vias, and fans to maintain the junction temperature within safe limits and prevent thermal throttling.

4. Clock Distribution:

Optimize the clock distribution network to ensure stable and accurate clock signals reach the FPGA. Use low-skew clock routing techniques, such as tree structures or clock buffers, to minimize clock skew and jitter and maximize timing performance.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier design verification, debug, and incremental implementation. Utilize hierarchical design techniques and IP cores to streamline the development process and improve design scalability.

Considerations:

When designing with 5SGXMA4H3F35C2LN, it's important to consider:

- Resource Utilization: Optimize resource utilization to maximize FPGA efficiency and minimize resource contention.

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing closure and meet the design's performance requirements.

- Design Constraints: Define appropriate design constraints, such as timing, placement, and routing constraints, to guide the synthesis and place-and-route process for optimal results.

- Design Verification: Rigorously verify the design through simulation, emulation, and hardware testing to ensure functional correctness and reliability.

- Design Iteration: Iterate on the design based on feedback from simulation and testing to refine and improve performance, power efficiency, and reliability.

5SGXMA4H3F35C2LN FAQ

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3. Are the 5SGXMA4H3F35C2LN price and inventory displayed accurate?

The price and inventory of 5SGXMA4H3F35C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA4H3F35C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA4H3F35C2LN we delivered, we will accept the replacement or return of the 5SGXMA4H3F35C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA4H3F35C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations