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Name: 5SGXMA4H2F35C3N
Brand: Intel
SKU: 5SGXMA4H2F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA4H2F35C3N

Part No.:: 5SGXMA4H2F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA4H2F35C3N.pdf

Description:: IC FPGA 600 1152FBGA

In Stock:: 3595

Quantity:: Add To Cart

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5SGXMA4H2F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
158500
NumberofLogicElements/Cells:
420000
TotalRAMBits:
37888000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA4H2F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA4H2F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA4H2F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA4H2F35C3N information

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5SGXMA4H2F35C3N Application Introduction

5SGXMA4H2F35C3N is an FPGA (Field-Programmable Gate Array) device known for its high performance and versatility in various electronic design projects. When effectively utilized, it can significantly enhance the functionality and efficiency of the designed system.

Power Management:

To optimize power consumption in a design featuring 5SGXMA4H2F35C3N, consider implementing power-saving techniques such as dynamic voltage and frequency scaling (DVFS). Utilize the FPGA's power management features to dynamically adjust the voltage and frequency of operation based on the workload, thereby minimizing power consumption during idle or low-demand periods.

Signal Integrity:

To ensure reliable signal integrity in designs incorporating 5SGXMA4H2F35C3N, pay attention to high-speed signal routing and impedance matching. Properly terminate transmission lines and utilize controlled impedance traces to minimize signal reflections and ensure robust communication between different components of the system.

Thermal Management:

Effective thermal management is crucial for maintaining the optimal operating temperature of 5SGXMA4H2F35C3N and preventing overheating. Utilize thermal vias and heat sinks to dissipate heat efficiently from the FPGA device. Additionally, consider implementing active cooling solutions such as fans or heat pipes to further enhance thermal dissipation and ensure reliable long-term operation.

Clock Distribution:

Proper clock distribution is essential for synchronous operation and timing accuracy in designs utilizing 5SGXMA4H2F35C3N. Implement a well-designed clock distribution network to ensure uniform clock signals reach all components of the system with minimal skew and jitter. Utilize advanced clocking resources available in the FPGA, such as PLLs (Phase-Locked Loops) and DCMs (Digital Clock Managers), to generate stable clock signals and adjust phase relationships as needed.

Board Layout:

Optimize the PCB (Printed Circuit Board) layout to minimize signal interference and facilitate efficient routing of signals between different components, including 5SGXMA4H2F35C3N and peripheral devices. Follow best practices for high-speed digital design, such as proper grounding techniques, signal isolation, and differential routing, to ensure optimal performance and reliability of the overall system.

Considerations:

When designing with 5SGXMA4H2F35C3N, it's essential to consider:

- Design Flexibility: Leverage the FPGA's reprogrammable nature to iterate and optimize the design for different applications and evolving requirements.

- Resource Utilization: Efficiently utilize the available resources, including logic elements, memory blocks, and DSP (Digital Signal Processing) slices, to maximize the functionality and performance of the design.

- Security: Implement security measures, such as encryption and authentication, to protect sensitive data and intellectual property stored or processed within the FPGA-based system.

- Testability: Design the system with built-in test features, such as boundary scan chains and JTAG (Joint Test Action Group) interfaces, to facilitate thorough testing and debugging during development and production phases.

- Future Expansion: Plan for scalability and future expansion by leaving ample room for additional functionality and connectivity options within the design architecture.

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6. What is the process for return or replacement of 5SGXMA4H2F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA4H2F35C3N we delivered, we will accept the replacement or return of the 5SGXMA4H2F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA4H2F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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