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Name: 5SGXMA4H1F35C2LN
Brand: Intel
SKU: 5SGXMA4H1F35C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA4H1F35C2LN

Part No.:: 5SGXMA4H1F35C2LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA4H1F35C2LN.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2115

Quantity:: Add To Cart

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5SGXMA4H1F35C2LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
158500
NumberofLogicElements/Cells:
420000
TotalRAMBits:
37888000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA4H1F35C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA4H1F35C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA4H1F35C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA4H1F35C2LN information

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5SGXMA4H1F35C2LN Application Introduction

5SGXMA4H1F35C2LN is a high-performance FPGA chip manufactured by Intel, offering a wide range of capabilities for advanced digital design projects.

Application Scenario:

In the realm of telecommunications, 5SGXMA4H1F35C2LN can be utilized to develop sophisticated networking equipment, such as routers and switches, enabling high-speed data processing and packet routing.

Design Optimization:

To optimize the design using 5SGXMA4H1F35C2LN, consider the following techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and enhance overall energy efficiency. Utilize advanced power gating techniques and low-power modes offered by 5SGXMA4H1F35C2LN to dynamically adjust power usage based on workload requirements.

2. Signal Integrity:

Ensure robust signal integrity by carefully designing the PCB layout and incorporating signal termination techniques. Pay special attention to high-speed interfaces and clock distribution networks to mitigate signal reflections, crosstalk, and jitter, thereby maximizing system reliability.

3. Thermal Management:

Effectively manage thermal dissipation to prevent overheating and ensure reliable operation of 5SGXMA4H1F35C2LN and surrounding components. Employ heatsinks, thermal vias, and adequate airflow within the system enclosure to dissipate heat generated during operation and maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and precise clock signals to 5SGXMA4H1F35C2LN and associated peripherals. Utilize clock conditioning circuits, such as PLLs and DLLs, to generate and synchronize clock signals with minimal jitter and phase noise, ensuring reliable timing for critical system operations.

5. Design for Testability:

Incorporate built-in self-test (BIST) features and debug interfaces to facilitate testing and debugging of the FPGA design. Utilize on-chip resources, such as JTAG ports and internal logic analyzers, to enable comprehensive testing and validation of the design functionality, helping to identify and resolve potential issues early in the development cycle.

Considerations:

When optimizing the design, it's important to consider:

- Resource Utilization: Efficiently utilize the available FPGA resources, such as logic cells, memory blocks, and DSP slices, to meet performance requirements while minimizing resource wastage.

- Design Constraints: Adhere to design constraints, including timing, area, and power constraints, to ensure the design meets performance targets and can be successfully implemented on 5SGXMA4H1F35C2LN.

- Design Iteration: Iteratively refine the design through simulation, synthesis, and implementation stages to optimize performance, minimize resource utilization, and address any design issues or bottlenecks.

- Future Scalability: Design the FPGA implementation with scalability in mind, allowing for future expansion and upgrades to accommodate evolving project requirements and technological advancements.

5SGXMA4H1F35C2LN FAQ

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3. Are the 5SGXMA4H1F35C2LN price and inventory displayed accurate?

The price and inventory of 5SGXMA4H1F35C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA4H1F35C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA4H1F35C2LN we delivered, we will accept the replacement or return of the 5SGXMA4H1F35C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA4H1F35C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations