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Name: 5SGXMA3K3F35C3N
Brand: Intel
SKU: 5SGXMA3K3F35C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3K3F35C3N

Part No.:: 5SGXMA3K3F35C3N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3K3F35C3N.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2239

Quantity:: Add To Cart

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5SGXMA3K3F35C3N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3K3F35C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3K3F35C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3K3F35C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3K3F35C3N information

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5SGXMA3K3F35C3N Application Introduction

5SGXMA3K3F35C3N is a high-performance FPGA device manufactured by Intel, offering a wide range of capabilities for designing complex digital systems.

Application Scope:

In applications such as telecommunications, data processing, and industrial automation, 5SGXMA3K3F35C3N can be utilized for tasks such as signal processing, protocol conversion, and high-speed data handling.

Design Considerations:

When incorporating 5SGXMA3K3F35C3N into a project, several key factors should be considered to optimize performance and reliability.

1. Power Management:

Implement efficient power management strategies to ensure stable voltage and current supply to 5SGXMA3K3F35C3N and associated peripherals. Utilize voltage regulators, decoupling capacitors, and power sequencing circuits to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design PCB layouts carefully to minimize signal degradation and ensure proper signal integrity. Use controlled impedance traces, minimize signal reflections, and employ differential signaling techniques where applicable to mitigate noise and interference.

3. Thermal Management:

To prevent overheating and ensure optimal performance, incorporate effective thermal management solutions such as heat sinks, fans, or thermal vias in the PCB layout. Ensure proper airflow and heat dissipation within the system enclosure.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 5SGXMA3K3F35C3N and other clock-dependent components. Use low-skew clock distribution techniques and minimize clock routing lengths to maintain signal integrity.

5. Design for Testability:

Implement built-in self-test (BIST) features and debug interfaces to facilitate testing and debugging of the FPGA design. Incorporate JTAG or other debugging interfaces for real-time monitoring and debugging during development and deployment phases.

Additional Considerations:

In addition to the above, consider the following aspects for optimizing 5SGXMA3K3F35C3N design:

- Resource Utilization: Efficiently utilize FPGA resources such as logic cells, memory blocks, and DSP slices to maximize performance and minimize resource contention.

- Timing Constraints: Define and meet timing constraints to ensure proper operation of synchronous digital circuits and avoid timing violations that could lead to functional errors or performance degradation.

- Security: Implement security features such as encryption, authentication, and secure boot mechanisms to protect intellectual property and ensure system integrity.

- Compliance: Ensure compliance with industry standards and regulations relevant to the application domain, such as FCC regulations for electromagnetic compatibility (EMC) or safety standards for industrial equipment.

- Documentation: Maintain comprehensive documentation including design specifications, schematics, PCB layouts, and firmware/software code to aid in design verification, troubleshooting, and future maintenance.

5SGXMA3K3F35C3N FAQ

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3. Are the 5SGXMA3K3F35C3N price and inventory displayed accurate?

The price and inventory of 5SGXMA3K3F35C3N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA3K3F35C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3K3F35C3N we delivered, we will accept the replacement or return of the 5SGXMA3K3F35C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3K3F35C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations