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Name: 5SGXMA3K2F35I2N
Brand: Intel
SKU: 5SGXMA3K2F35I2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3K2F35I2N

Part No.:: 5SGXMA3K2F35I2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3K2F35I2N.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2703

Quantity:: Add To Cart

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5SGXMA3K2F35I2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMA3K2F35I2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3K2F35I2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3K2F35I2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3K2F35I2N information

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5SGXMA3K2F35I2N Application Introduction

5SGXMA3K2F35I2N is a high-capacity field-programmable gate array (FPGA) device manufactured by Intel, offering advanced features and performance for demanding applications in various fields such as telecommunications, aerospace, and industrial automation.

Application Scenario:

In telecommunications infrastructure, 5SGXMA3K2F35I2N can be utilized to implement complex signal processing algorithms for tasks such as real-time data encryption and decryption in secure communication systems.

Design Optimization:

To effectively utilize 5SGXMA3K2F35I2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and ensure reliable operation of 5SGXMA3K2F35I2N. Utilize power gating, dynamic voltage and frequency scaling, and low-power standby modes to optimize power usage during idle and active states.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and ensure robust signal integrity for 5SGXMA3K2F35I2N. Use controlled impedance traces, proper ground and power plane distribution, and signal termination techniques to mitigate signal reflections and noise.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure the longevity of 5SGXMA3K2F35I2N. Utilize heat sinks, thermal vias, and fans for active cooling, and optimize airflow within the enclosure to dissipate heat efficiently.

4. Clocking:

Optimize clocking architectures to meet timing constraints and maximize performance in 5SGXMA3K2F35I2N designs. Use dedicated clock networks, PLLs, and clock distribution strategies to minimize clock skew and jitter and ensure synchronous operation of all components.

5. Design Partitioning:

Break down the design into manageable modules and utilize the resources of 5SGXMA3K2F35I2N efficiently. Implement hierarchical design methodologies, utilize IP cores and intellectual property blocks, and optimize resource utilization through careful design partitioning and optimization.

Considerations:

When designing with 5SGXMA3K2F35I2N, it's essential to consider:

- Resource Utilization: Optimize the usage of FPGA resources, including logic cells, memory blocks, and DSP slices, to maximize performance and minimize resource constraints.

- Design Constraints: Ensure compliance with timing, area, and power constraints specified by the target application and the capabilities of 5SGXMA3K2F35I2N.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to identify and address potential issues related to functionality, performance, and reliability.

- Design Security: Implement security features and measures, such as bitstream encryption, secure booting, and anti-tamper mechanisms, to protect the intellectual property and integrity of the design implemented on 5SGXMA3K2F35I2N.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades and expansions, considering factors such as interface compatibility, resource scalability, and architectural flexibility.

5SGXMA3K2F35I2N FAQ

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3. Are the 5SGXMA3K2F35I2N price and inventory displayed accurate?

The price and inventory of 5SGXMA3K2F35I2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA3K2F35I2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3K2F35I2N we delivered, we will accept the replacement or return of the 5SGXMA3K2F35I2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3K2F35I2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations