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Name: 5SGXMA3K2F35I2LN
Brand: Intel
SKU: 5SGXMA3K2F35I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3K2F35I2LN

Part No.:: 5SGXMA3K2F35I2LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3K2F35I2LN.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 3038

Quantity:: Add To Cart

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5SGXMA3K2F35I2LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMA3K2F35I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3K2F35I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3K2F35I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3K2F35I2LN information

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5SGXMA3K2F35I2LN Application Introduction

5SGXMA3K2F35I2LN is a high-capacity FPGA device manufactured by Intel, offering advanced features and flexibility for designing complex digital systems.

Application Scenario:

In telecommunications infrastructure, 5SGXMA3K2F35I2LN can be utilized for implementing high-speed data processing and protocol handling tasks in network equipment.

Circuit Design:

To effectively use 5SGXMA3K2F35I2LN in a design project, consider the following optimizations:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of resources and minimize power consumption. Utilize power gating and dynamic voltage scaling strategies to achieve power savings during idle and low-load conditions.

2. Signal Integrity:

Ensure signal integrity by carefully designing high-speed signal traces and minimizing signal reflections and crosstalk. Utilize impedance matching techniques and controlled impedance routing for critical signal paths to maintain signal integrity and reduce noise.

3. Thermal Management:

Manage thermal considerations by incorporating proper heat dissipation mechanisms, such as heatsinks or fans, to maintain the operating temperature of 5SGXMA3K2F35I2LN within safe limits. Optimize the placement of heat-generating components and ensure adequate airflow within the system enclosure to prevent overheating.

4. Resource Utilization:

Optimize resource utilization by carefully mapping the design onto the FPGA fabric, utilizing advanced synthesis and optimization techniques provided by FPGA development tools. Analyze resource utilization reports to identify opportunities for optimization and efficient allocation of logic elements, memory blocks, and DSP resources.

5. Design Partitioning:

Partition the design into manageable blocks and utilize hierarchical design methodologies to improve design scalability and maintainability. Utilize IP cores and pre-designed modules to accelerate development and reduce time-to-market, while ensuring compatibility and interoperability with 5SGXMA3K2F35I2LN.

Considerations:

When optimizing the design, consider:

- Timing Closure: Perform timing analysis and optimization to ensure that the design meets timing constraints and achieves maximum operating frequency.

- Design Security: Implement security measures, such as encryption and authentication, to protect intellectual property and prevent unauthorized access to the design implemented on 5SGXMA3K2F35I2LN.

- Test and Verification: Develop comprehensive testbenches and verification strategies to validate the functionality and performance of the design, ensuring compliance with design specifications and requirements.

- Design Iteration: Iterate the design process, incorporating feedback and enhancements to improve performance, reliability, and scalability of the final design implemented on 5SGXMA3K2F35I2LN.

5SGXMA3K2F35I2LN FAQ

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3. Are the 5SGXMA3K2F35I2LN price and inventory displayed accurate?

The price and inventory of 5SGXMA3K2F35I2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA3K2F35I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3K2F35I2LN we delivered, we will accept the replacement or return of the 5SGXMA3K2F35I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3K2F35I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations