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Name: 5SGXMA3K1F35I2N
Brand: Intel
SKU: 5SGXMA3K1F35I2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3K1F35I2N

Part No.:: 5SGXMA3K1F35I2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3K1F35I2N.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2583

Quantity:: Add To Cart

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5SGXMA3K1F35I2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMA3K1F35I2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3K1F35I2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3K1F35I2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3K1F35I2N information

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5SGXMA3K1F35I2N Application Introduction

5SGXMA3K1F35I2N is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering advanced features and performance for a wide range of applications.

Application Scenario:

In digital signal processing (DSP) applications, 5SGXMA3K1F35I2N can be utilized for real-time data processing, such as in radar systems or image processing applications.

Design Optimization:

To effectively utilize 5SGXMA3K1F35I2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation. Utilize power gating techniques and dynamic voltage scaling to optimize power usage in different operational modes.

2. Signal Integrity:

Design PCB layouts with careful consideration of signal integrity principles to minimize signal distortion and ensure reliable data transmission. Employ techniques such as impedance matching, controlled impedance traces, and proper grounding to mitigate signal integrity issues.

3. Thermal Management:

Manage the thermal performance of the 5SGXMA3K1F35I2N device to prevent overheating and ensure long-term reliability. Utilize thermal vias, heat sinks, and proper airflow in the system enclosure to dissipate heat effectively.

4. Timing Closure:

Optimize the design for timing closure to meet the required performance specifications. Utilize advanced synthesis and place-and-route techniques to minimize timing violations and maximize the operating frequency of the FPGA design.

5. Resource Utilization:

Maximize the utilization of resources within the 5SGXMA3K1F35I2N device to achieve optimal performance and efficiency. Utilize resource sharing, pipelining, and parallel processing techniques to fully exploit the capabilities of the FPGA architecture.

Considerations:

When optimizing the design, it's important to consider:

- Design Constraints: Understand and adhere to the design constraints specified by the FPGA device datasheet and toolchain to ensure compatibility and reliability.

- Design Partitioning: Partition the design into smaller modules or blocks to facilitate easier implementation, debugging, and verification.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to ensure functional correctness and performance compliance with the design requirements.

- Design Documentation: Maintain comprehensive documentation throughout the design process to facilitate future maintenance, troubleshooting, and knowledge transfer.

5SGXMA3K1F35I2N FAQ

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3. Are the 5SGXMA3K1F35I2N price and inventory displayed accurate?

The price and inventory of 5SGXMA3K1F35I2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA3K1F35I2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3K1F35I2N we delivered, we will accept the replacement or return of the 5SGXMA3K1F35I2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3K1F35I2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations