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Name: 5SGXMA3K1F35C2N
Brand: Intel
SKU: 5SGXMA3K1F35C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3K1F35C2N

Part No.:: 5SGXMA3K1F35C2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3K1F35C2N.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2635

Quantity:: Add To Cart

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5SGXMA3K1F35C2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3K1F35C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3K1F35C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3K1F35C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3K1F35C2N information

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5SGXMA3K1F35C2N Application Introduction

5SGXMA3K1F35C2N is a high-density and high-performance FPGA (Field Programmable Gate Array) device, widely used in various applications such as telecommunications, automotive, aerospace, and industrial automation.

Application Scenario:

In the telecommunications sector, 5SGXMA3K1F35C2N can be utilized for implementing advanced signal processing algorithms in communication systems, enabling high-speed data transmission and efficient network management.

Circuit Design:

To effectively utilize 5SGXMA3K1F35C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources on 5SGXMA3K1F35C2N. Utilize dynamic voltage and frequency scaling (DVFS) to adjust the operating voltage and frequency dynamically based on the workload, thereby reducing power consumption without compromising performance.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as signal crosstalk, reflections, and jitter. Utilize proper termination techniques, impedance matching, and signal routing guidelines to maintain signal integrity and ensure reliable data transmission within the FPGA and between external devices.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of 5SGXMA3K1F35C2N. Utilize heat sinks, thermal vias, and fans for efficient heat dissipation. Ensure adequate airflow and ventilation in the system enclosure to maintain optimal operating temperatures.

4. Design Optimization:

Optimize the FPGA design to maximize resource utilization and performance efficiency. Utilize advanced synthesis and optimization techniques to minimize logic utilization, reduce critical path delays, and improve overall design performance. Employ pipelining, parallel processing, and resource sharing techniques to optimize the use of FPGA resources.

5. Reliability and Testing:

Conduct thorough testing and validation of the FPGA design to ensure reliability and robustness. Perform functional testing, timing analysis, and stress testing under various operating conditions to verify the functionality, performance, and reliability of 5SGXMA3K1F35C2N-based systems.

Considerations:

When designing with 5SGXMA3K1F35C2N, it's essential to consider:

- Design Constraints: Understand and adhere to the design constraints specified by the FPGA vendor, including timing constraints, resource utilization limits, and power requirements.

- Design Security: Implement appropriate security measures, such as bitstream encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Design Reusability: Design the FPGA system with modularity and scalability in mind to facilitate reuse and future upgrades. Utilize IP cores, standard interfaces, and design patterns to enhance design reusability and maintainability.

- Design Documentation: Maintain comprehensive documentation throughout the design process, including design specifications, schematics, PCB layouts, and test reports, to facilitate collaboration, troubleshooting, and future maintenance.

5SGXMA3K1F35C2N FAQ

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3. Are the 5SGXMA3K1F35C2N price and inventory displayed accurate?

The price and inventory of 5SGXMA3K1F35C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA3K1F35C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3K1F35C2N we delivered, we will accept the replacement or return of the 5SGXMA3K1F35C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3K1F35C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations