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Name: 5SGXMA3H3F35I3LG
Brand: Intel
SKU: 5SGXMA3H3F35I3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3H3F35I3LG

Part No.:: 5SGXMA3H3F35I3LG

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 3142

Quantity:: Add To Cart

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5SGXMA3H3F35I3LG Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMA3H3F35I3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3H3F35I3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3H3F35I3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3H3F35I3LG information

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The working principle and core technical features of 5SGXMA3H3F35I3LG

5SGXMA3H3F35I3LG is an advanced FPGA (Field-Programmable Gate Array) with high performance and flexibility, commonly used in various high-end applications. It features extensive logic resources, high-speed transceivers, and robust design tools.

Application Scenario:

In telecommunications, this chip can be utilized to implement high-speed data processing and transmission systems, such as baseband processing in wireless communication networks.

Working Principle:

The 5SGXMA3H3F35I3LG operates by configuring its internal logic blocks and interconnects to perform specific functions defined by the user. This reconfigurability allows it to adapt to a wide range of applications. The core of the FPGA consists of programmable logic elements, memory blocks, and digital signal processing (DSP) blocks. The high-speed transceivers enable efficient data communication at rates up to 28 Gbps, making it suitable for high-bandwidth applications.

Core Technical Features:

1. Logic Resources:

The FPGA provides a vast array of logic elements that can be programmed to perform various digital functions. This flexibility is essential for designing complex systems that require custom logic implementations.

2. High-Speed Transceivers:

The transceivers in 5SGXMA3H3F35I3LG support data rates up to 28 Gbps, making it ideal for applications that require high-speed serial communication. These transceivers are used in applications like high-speed networking and data centers.

3. DSP Blocks:

The integrated DSP blocks enable efficient processing of digital signals, which is crucial for applications such as video processing, wireless communication, and real-time data analytics.

4. Memory Resources:

The FPGA includes large amounts of on-chip memory, which can be used for data storage and buffering. This is particularly useful in applications that require high-speed data processing and real-time operations.

Enhancing System Performance and Efficiency:

To maximize the performance and efficiency of systems using 5SGXMA3H3F35I3LG, consider the following strategies:

1. Optimize Logic Utilization:

Efficiently map the logic functions to the FPGA resources to minimize logic element usage and improve performance. Use design tools to identify and eliminate redundant logic.

2. High-Speed Design Techniques:

Employ high-speed design techniques such as proper signal routing, impedance matching, and minimizing crosstalk. These techniques help maintain signal integrity and achieve the maximum data rates supported by the transceivers.

3. Power Management:

Implement power management strategies to reduce power consumption, such as using low-power design techniques, dynamic power management, and utilizing power-down modes when parts of the FPGA are not in use.

4. Efficient Memory Usage:

Optimize the use of on-chip memory by efficiently managing data storage and access patterns. This can help reduce latency and improve overall system performance.

5. Parallel Processing:

Leverage the parallel processing capabilities of the FPGA to perform multiple operations simultaneously. This is particularly beneficial in applications that require high throughput and low latency.

Considerations:

When designing with 5SGXMA3H3F35I3LG, it's essential to consider:

- Signal Integrity: Ensure proper design practices to maintain signal integrity, especially when dealing with high-speed transceivers.

- Thermal Management: Implement adequate cooling solutions to manage the heat generated by the FPGA during operation.

- Design Verification: Thoroughly verify the design using simulation and hardware testing to ensure it meets the required specifications and performance criteria.

- Scalability: Design the system with scalability in mind to accommodate future upgrades and changes in application requirements.

5SGXMA3H3F35I3LG FAQ

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6. What is the process for return or replacement of 5SGXMA3H3F35I3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3H3F35I3LG we delivered, we will accept the replacement or return of the 5SGXMA3H3F35I3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3H3F35I3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations