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Name: 5SGXMA3H3F35C2N
Brand: Intel
SKU: 5SGXMA3H3F35C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3H3F35C2N

Part No.:: 5SGXMA3H3F35C2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3H3F35C2N.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2218

Quantity:: Add To Cart

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5SGXMA3H3F35C2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3H3F35C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3H3F35C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3H3F35C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3H3F35C2N information

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5SGXMA3H3F35C2N Application Introduction

5SGXMA3H3F35C2N is a high-density and high-performance FPGA (Field-Programmable Gate Array) device suitable for a wide range of applications, including telecommunications, industrial automation, and automotive electronics.

Application Scenario:

In telecommunications infrastructure, 5SGXMA3H3F35C2N can be utilized for tasks such as signal processing, protocol handling, and data encryption in network equipment like routers and switches.

Circuit Design:

To effectively utilize 5SGXMA3H3F35C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure stable operation of 5SGXMA3H3F35C2N. Utilize power gating techniques, dynamic voltage scaling, and low-power modes when the device is idle or operating at reduced performance levels.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal distortion, crosstalk, and electromagnetic interference. Follow best practices for high-speed signal routing, impedance matching, and ground/power plane distribution to maintain signal integrity and reliability.

3. Thermal Management:

Ensure effective thermal dissipation to prevent overheating and maintain optimal performance of 5SGXMA3H3F35C2N. Use heat sinks, thermal vias, and proper airflow/cooling mechanisms to manage the device temperature within acceptable limits.

4. Clocking Architecture:

Design a robust clocking architecture with low jitter and skew to synchronize the operation of 5SGXMA3H3F35C2N and connected peripherals. Utilize dedicated clocking resources, PLLs (Phase-Locked Loops), and clock distribution networks to achieve precise timing control and synchronization.

5. Configuration and Debugging:

Implement reliable configuration and debugging mechanisms to facilitate FPGA programming, configuration, and real-time debugging of the design. Utilize JTAG interfaces, configuration flash memories, and on-chip debug modules for efficient design testing and debugging.

Considerations:

When optimizing the design with 5SGXMA3H3F35C2N, it's important to consider:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic cells, memory blocks, and DSP slices, to maximize design performance and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met, and the design operates reliably at the desired clock frequencies.

- Design Modularity: Partition the design into modular blocks to facilitate design reuse, scalability, and easier maintenance. Utilize hierarchical design methodologies and IP (Intellectual Property) cores for efficient design implementation.

- Design Security: Implement security features, such as bitstream encryption and authentication mechanisms, to protect the FPGA design from unauthorized access, tampering, and IP theft.

- Compliance and Standards: Ensure the design complies with relevant industry standards, such as PCI Express, DDR memory interfaces, and Ethernet protocols, to ensure interoperability and compatibility with other system components.

5SGXMA3H3F35C2N FAQ

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6. What is the process for return or replacement of 5SGXMA3H3F35C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3H3F35C2N we delivered, we will accept the replacement or return of the 5SGXMA3H3F35C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3H3F35C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations