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Name: 5SGXMA3H1F35C2N
Brand: Intel
SKU: 5SGXMA3H1F35C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA3H1F35C2N

Part No.:: 5SGXMA3H1F35C2N

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3H1F35C2N.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2681

Quantity:: Add To Cart

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5SGXMA3H1F35C2N Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3H1F35C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3H1F35C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3H1F35C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3H1F35C2N information

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5SGXMA3H1F35C2N Application Introduction

5SGXMA3H1F35C2N is a high-performance FPGA device commonly used in various digital design projects, offering a wide range of capabilities for complex applications.

Application Scenario:

In digital signal processing applications, 5SGXMA3H1F35C2N can be utilized to implement sophisticated algorithms for tasks such as image processing or communications.

Design Optimization:

To effectively utilize 5SGXMA3H1F35C2N in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption of 5SGXMA3H1F35C2N and associated components. Utilize low-power modes and dynamic voltage scaling to minimize energy usage during idle or low-activity periods.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing PCB layouts and routing high-speed signals. Use impedance matching techniques and proper termination to minimize signal reflections and ensure reliable communication within the FPGA and with external components.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating of 5SGXMA3H1F35C2N during operation. Utilize thermal vias, heatsinks, and airflow optimization to dissipate heat generated by the FPGA and maintain optimal operating temperatures.

4. Clock Distribution:

Design a robust clock distribution network to ensure stable and accurate clock signals throughout the FPGA design. Use PLLs and clock buffers to generate and distribute clock signals with minimal skew and jitter, enhancing overall system performance.

5. Design Partitioning:

Partition the FPGA design into logical modules to facilitate easier design verification, debugging, and scalability. Utilize hierarchical design methodologies to manage complexity and improve design reusability.

Considerations:

When optimizing your design with 5SGXMA3H1F35C2N, keep in mind the following considerations:

- Resource Utilization: Optimize FPGA resource usage to maximize performance and minimize area utilization.

- Timing Closure: Ensure timing constraints are met to guarantee correct operation of the design across different operating conditions and process variations.

- Design Security: Implement security features, such as encryption and authentication, to protect the FPGA design from unauthorized access and tampering.

- Testability: Design for testability by incorporating built-in self-test (BIST) features and test access mechanisms (TAMs) to facilitate efficient manufacturing testing and FPGA validation.

- Documentation: Maintain comprehensive documentation throughout the design process to aid in design review, troubleshooting, and future maintenance.

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3. Are the 5SGXMA3H1F35C2N price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXMA3H1F35C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3H1F35C2N we delivered, we will accept the replacement or return of the 5SGXMA3H1F35C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3H1F35C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations