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Name: 5SGXMA3H1F35C2LN
Brand: Intel
SKU: 5SGXMA3H1F35C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3H1F35C2LN

Part No.:: 5SGXMA3H1F35C2LN

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:: 5SGXMA3H1F35C2LN.pdf

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 3656

Quantity:: Add To Cart

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5SGXMA3H1F35C2LN Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3H1F35C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3H1F35C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3H1F35C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3H1F35C2LN information

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5SGXMA3H1F35C2LN Application Introduction

5SGXMA3H1F35C2LN is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering advanced features and performance suitable for a wide range of applications.

Application Overview:

In digital signal processing (DSP) applications, 5SGXMA3H1F35C2LN can be utilized for tasks such as real-time audio and video processing, radar signal processing, and communications signal modulation.

Circuit Design:

To effectively utilize 5SGXMA3H1F35C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption and ensure reliable operation of 5SGXMA3H1F35C2LN. Utilize power gating techniques, dynamic voltage scaling, and standby modes when feasible to minimize power consumption during idle periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as reflections, crosstalk, and electromagnetic interference (EMI). Proper impedance matching, signal routing, and ground plane design are essential to maintain signal integrity and maximize the performance of 5SGXMA3H1F35C2LN.

3. Thermal Management:

Implement effective thermal management techniques to prevent overheating and ensure reliable operation of 5SGXMA3H1F35C2LN. Use thermal vias, heat sinks, and fans to dissipate heat generated by the FPGA and other components on the board. Monitor the temperature of critical components and adjust the cooling system as needed to maintain optimal operating temperatures.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring stable clock signals for 5SGXMA3H1F35C2LN and other components in the system. Use low-skew clock distribution networks, such as clock buffers and fanout buffers, to distribute clock signals with minimal delay and distortion.

5. Configuration Management:

Implement secure and efficient configuration management strategies for 5SGXMA3H1F35C2LN to enable easy reconfiguration and remote updates. Utilize configuration memory devices, such as flash memory or external configuration PROMs, to store FPGA bitstreams securely. Implement encryption and authentication mechanisms to protect against unauthorized access and tampering of configuration data.

Considerations:

When designing with 5SGXMA3H1F35C2LN, consider the following factors to ensure optimal performance and reliability:

- Design Constraints: Understand the design constraints and limitations of 5SGXMA3H1F35C2LN, such as maximum operating frequency, resource utilization, and timing requirements.

- Design Validation: Perform thorough testing and verification of the design to identify and address any functional or performance issues early in the development cycle.

- Design for Manufacturability: Consider manufacturing constraints and requirements when designing the PCB layout and assembly process to ensure cost-effective and reliable production of the final product.

- Design Documentation: Maintain comprehensive documentation of the design, including schematics, PCB layouts, bill of materials (BOM), and design files, to facilitate collaboration, troubleshooting, and future revisions.

5SGXMA3H1F35C2LN FAQ

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3. Are the 5SGXMA3H1F35C2LN price and inventory displayed accurate?

The price and inventory of 5SGXMA3H1F35C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA3H1F35C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3H1F35C2LN we delivered, we will accept the replacement or return of the 5SGXMA3H1F35C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3H1F35C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations