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Name: 5SGXMA3H1F35C1G
Brand: Intel
SKU: 5SGXMA3H1F35C1G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3H1F35C1G

Part No.:: 5SGXMA3H1F35C1G

Manufacturer:: Intel

Package:: 1152-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 1152FBGA

In Stock:: 2501

Quantity:: Add To Cart

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5SGXMA3H1F35C1G Specifications

Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3H1F35C1G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3H1F35C1G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3H1F35C1G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3H1F35C1G information

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5SGXMA3H1F35C1G Application Introduction

5SGXMA3H1F35C1G is an advanced FPGA chip, designed for high-performance computing and complex digital signal processing applications. It offers a range of features, including high logic density, robust I/O capabilities, and efficient power management.

Application Scenario:

In telecommunications, this chip can be used to manage data transmission and processing in high-speed networks, ensuring efficient and reliable communication.

Circuit Design:

To design a data processing unit using 5SGXMA3H1F35C1G, follow these steps:

1. Power Management:

Ensure the FPGA is supplied with stable and clean power. Use a combination of low-dropout (LDO) regulators and switching regulators to achieve the required voltage levels. Decoupling capacitors should be placed close to the power pins of the 5SGXMA3H1F35C1G to minimize noise and voltage fluctuations.

2. Signal Integrity:

Maintain signal integrity by carefully designing the PCB layout. Use differential signaling for high-speed I/O pins and ensure proper impedance matching. Place ground planes adjacent to signal layers to reduce electromagnetic interference (EMI) and crosstalk.

3. Thermal Management:

Implement effective thermal management strategies to dissipate the heat generated by the 5SGXMA3H1F35C1G. Use heat sinks and consider incorporating a thermal interface material between the chip and the heat sink. Additionally, ensure adequate airflow within the enclosure to prevent overheating.

4. Clock Distribution:

Design a robust clock distribution network to ensure minimal jitter and skew. Use high-quality clock oscillators and buffers. Place the clock source close to the 5SGXMA3H1F35C1G to minimize trace lengths and associated delays.

Considerations:

When designing the circuit, it's essential to consider:

- Power Sequencing: Ensure proper power-up and power-down sequencing to avoid damaging the FPGA.

- Signal Termination: Use appropriate termination techniques to reduce reflections and maintain signal integrity.

- PCB Layout: Follow best practices for PCB layout, such as minimizing loop areas and avoiding sharp corners in trace routing.

- Heat Dissipation: Regularly monitor the operating temperature of the FPGA to ensure it remains within safe limits.

- Testing and Validation: Perform thorough testing to validate the functionality and performance of the design under various conditions.

5SGXMA3H1F35C1G FAQ

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3. Are the 5SGXMA3H1F35C1G price and inventory displayed accurate?

The price and inventory of 5SGXMA3H1F35C1G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA3H1F35C1G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3H1F35C1G we delivered, we will accept the replacement or return of the 5SGXMA3H1F35C1G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3H1F35C1G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations