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Name: 5SGXMA3E3H29C2LN
Brand: Intel
SKU: 5SGXMA3E3H29C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA3E3H29C2LN

Part No.:: 5SGXMA3E3H29C2LN

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 5SGXMA3E3H29C2LN.pdf

Description:: IC FPGA 600 I/O 780HBGA

In Stock:: 3530

Quantity:: Add To Cart

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5SGXMA3E3H29C2LN Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3E3H29C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3E3H29C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3E3H29C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3E3H29C2LN information

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5SGXMA3E3H29C2LN Application Introduction

5SGXMA3E3H29C2LN is a high-performance FPGA chip designed by Intel for demanding applications, offering a wide range of features and capabilities.

Application Scenario:

In telecommunications infrastructure, 5SGXMA3E3H29C2LN can be utilized for implementing advanced signal processing algorithms, such as in baseband processing units for wireless communication systems.

Circuit Design:

To effectively utilize 5SGXMA3E3H29C2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources on 5SGXMA3E3H29C2LN. Utilize dynamic power management features provided by the FPGA, such as clock gating and power gating, to minimize power consumption during idle or low activity periods.

2. Signal Integrity:

Design the PCB layout to minimize signal integrity issues, such as signal crosstalk and reflections. Properly terminate high-speed signal lines and ensure controlled impedance matching for critical signal paths to maintain signal integrity and reliability.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating of 5SGXMA3E3H29C2LN during operation. Utilize thermal vias and heat sinks to dissipate heat efficiently and ensure proper airflow within the system enclosure to maintain a suitable operating temperature.

4. Clock Distribution:

Design a robust clock distribution network to ensure reliable clock signals are delivered to all components of the FPGA design. Use low-skew clock routing techniques and minimize clock tree skew to maintain synchronization and timing accuracy in the system.

5. Design Partitioning:

Partition the FPGA design into manageable modules to facilitate ease of design, testing, and maintenance. Utilize hierarchical design techniques to organize the design into logical blocks and optimize resource utilization on 5SGXMA3E3H29C2LN.

Considerations:

When designing with 5SGXMA3E3H29C2LN, it's essential to consider:

- Resource Utilization: Optimize resource utilization to maximize the efficiency of the FPGA design and minimize unnecessary resource usage.

- Timing Constraints: Ensure that timing constraints are met to guarantee proper operation of the FPGA design under all operating conditions.

- Design Debugging: Implement debugging features, such as JTAG interfaces and on-chip logic analyzers, to facilitate debugging and testing of the FPGA design during development.

- Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and ensure the integrity of the FPGA design.

- Design Verification: Perform thorough verification and validation of the FPGA design to ensure its correctness, robustness, and compliance with functional requirements.

5SGXMA3E3H29C2LN FAQ

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3. Are the 5SGXMA3E3H29C2LN price and inventory displayed accurate?

The price and inventory of 5SGXMA3E3H29C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA3E3H29C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3E3H29C2LN we delivered, we will accept the replacement or return of the 5SGXMA3E3H29C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3E3H29C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations