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Name: 5SGXMA3E2H29I2LN
Brand: Intel
SKU: 5SGXMA3E2H29I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXMA3E2H29I2LN

Part No.:: 5SGXMA3E2H29I2LN

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 5SGXMA3E2H29I2LN.pdf

Description:: IC FPGA 600 I/O 780HBGA

In Stock:: 2163

Quantity:: Add To Cart

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5SGXMA3E2H29I2LN Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXMA3E2H29I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3E2H29I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3E2H29I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3E2H29I2LN information

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5SGXMA3E2H29I2LN Application Introduction

5SGXMA3E2H29I2LN is a high-performance FPGA device manufactured by Intel, offering immense capabilities for advanced digital design projects. Its rich feature set and flexibility make it a preferred choice for various applications ranging from telecommunications to aerospace.

Application Scenario:

In the field of telecommunications, 5SGXMA3E2H29I2LN can be utilized for implementing complex signal processing algorithms, such as those required for 5G baseband processing or high-speed data encryption.

Circuit Design:

To effectively harness the power of 5SGXMA3E2H29I2LN in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal utilization of power resources within the FPGA. Utilize dynamic power gating techniques and power-saving modes available in 5SGXMA3E2H29I2LN to minimize power consumption during idle or low activity periods.

2. Signal Integrity:

Design the PCB layout with careful consideration for signal integrity to minimize signal distortion and ensure reliable data transmission within the FPGA and with external components. Utilize impedance matching techniques and proper termination schemes to mitigate signal reflections and crosstalk.

3. Thermal Management:

Manage the thermal environment of 5SGXMA3E2H29I2LN to prevent overheating and ensure reliable operation. Employ efficient heat sinking solutions and thermal vias in the PCB layout to dissipate heat generated during FPGA operation. Monitor temperature levels and implement dynamic thermal management algorithms to adjust FPGA performance based on temperature conditions.

4. Resource Utilization:

Optimize resource utilization within 5SGXMA3E2H29I2LN to maximize design efficiency and performance. Utilize advanced synthesis and optimization tools to minimize logic utilization, reduce routing congestion, and meet timing constraints. Implement modular design practices to facilitate design reuse and scalability.

5. Design Security:

Implement security measures to protect the intellectual property and sensitive data stored within 5SGXMA3E2H29I2LN. Utilize encryption techniques and access control mechanisms to safeguard design configurations and prevent unauthorized access or tampering.

Considerations:

When designing with 5SGXMA3E2H29I2LN, it's crucial to consider:

- Timing Closure: Ensure all timing constraints are met during the design implementation process to prevent timing violations and ensure reliable FPGA operation.

- Design Validation: Perform thorough functional and performance testing to validate the design's correctness and functionality under various operating conditions.

- Design Constraints: Adhere to design constraints such as power budget, board space limitations, and interface compatibility to achieve a successful design implementation.

- Design for Manufacturability: Consider manufacturing constraints and guidelines during the design phase to facilitate smooth production and assembly processes.

- Design Documentation: Maintain comprehensive documentation throughout the design process to aid in design review, debugging, and future design iterations.

5SGXMA3E2H29I2LN FAQ

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3. Are the 5SGXMA3E2H29I2LN price and inventory displayed accurate?

The price and inventory of 5SGXMA3E2H29I2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXMA3E2H29I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3E2H29I2LN we delivered, we will accept the replacement or return of the 5SGXMA3E2H29I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3E2H29I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations