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Name: 5SGXMA3E2H29C1G
Brand: Intel
SKU: 5SGXMA3E2H29C1G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXMA3E2H29C1G

Part No.:: 5SGXMA3E2H29C1G

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 780HBGA

In Stock:: 2901

Quantity:: Add To Cart

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5SGXMA3E2H29C1G Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
128300
NumberofLogicElements/Cells:
340000
TotalRAMBits:
19456000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXMA3E2H29C1G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXMA3E2H29C1G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXMA3E2H29C1G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXMA3E2H29C1G information

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The working principle and core technical features of 5SGXMA3E2H29C1G

5SGXMA3E2H29C1G is a high-performance FPGA (Field-Programmable Gate Array) device, widely used in complex digital signal processing and high-speed communication systems. It features advanced logic elements, extensive memory blocks, and high-speed transceivers.

Application Scenario:

In telecommunications, 5SGXMA3E2H29C1G can be employed in baseband signal processing units, enabling efficient data encoding and decoding in 5G networks.

Core Technology Features:

1. Advanced Logic Elements:

5SGXMA3E2H29C1G incorporates millions of logic elements that allow the implementation of complex algorithms and data processing tasks, providing unparalleled flexibility and performance in digital designs.

2. High-Speed Transceivers:

Equipped with high-speed transceivers, 5SGXMA3E2H29C1G supports data rates up to several gigabits per second, making it ideal for high-bandwidth applications such as video streaming and broadband communication.

3. Extensive Memory Blocks:

This chip includes extensive memory blocks that facilitate large data storage and fast access times, crucial for applications requiring high-speed data buffering and retrieval.

4. DSP Blocks:

The embedded DSP (Digital Signal Processing) blocks in this chip enable efficient real-time signal processing, essential for applications such as image processing, radar systems, and wireless communications.

5. Power Management:

Advanced power management features in this chip ensure efficient power consumption, extending the operational life of battery-powered devices and reducing overall system power requirements.

Application in Specific Systems:

In a video processing system, 5SGXMA3E2H29C1G can be utilized to handle high-definition video encoding and decoding, enhancing video quality and reducing latency.

1. Video Input Interface:

Connect video input sources, such as cameras, to the high-speed transceivers of this chip. These transceivers will handle the high data rates required for HD video streams.

2. Real-Time Processing:

Implement video processing algorithms using the logic elements and DSP blocks of this chip to perform tasks like noise reduction, frame interpolation, and color correction in real time.

3. Memory Management:

Utilize the extensive memory blocks of this chip to store and manage video frames, ensuring smooth playback and minimal buffering.

4. Output Interface:

Connect the processed video output to display devices or transmit it over high-speed communication links using the chip's transceivers.

5. Power Efficiency:

Optimize power management settings to ensure that the video processing system operates efficiently, balancing performance and power consumption.

Considerations:

When designing with this chip, consider the following:

- Signal Integrity: Ensure proper design practices to maintain signal integrity at high data rates.

- Thermal Management: Implement adequate cooling solutions to manage the heat generated by high-speed processing.

- Firmware Optimization: Write efficient firmware to maximize the performance of the FPGA's logic and DSP blocks.

- System Integration: Ensure seamless integration of this chip with other system components, such as processors and memory modules.

- Reliability: Thoroughly test the system to ensure reliability and robustness under various operational conditions.

5SGXMA3E2H29C1G FAQ

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3. Are the 5SGXMA3E2H29C1G price and inventory displayed accurate?

The price and inventory of 5SGXMA3E2H29C1G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXMA3E2H29C1G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXMA3E2H29C1G we delivered, we will accept the replacement or return of the 5SGXMA3E2H29C1G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXMA3E2H29C1G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations