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Name: 5SGXEBBR3H43C2N
Brand: Intel
SKU: 5SGXEBBR3H43C2N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEBBR3H43C2N

Part No.:: 5SGXEBBR3H43C2N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEBBR3H43C2N.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 3317

Quantity:: Add To Cart

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5SGXEBBR3H43C2N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEBBR3H43C2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEBBR3H43C2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEBBR3H43C2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEBBR3H43C2N information

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5SGXEBBR3H43C2N Application Introduction

5SGXEBBR3H43C2N is a high-capacity field-programmable gate array (FPGA) known for its advanced features and performance capabilities, widely used in complex digital designs across various industries.

Application Overview:

In digital signal processing applications, 5SGXEBBR3H43C2N can be utilized for implementing sophisticated algorithms, such as image processing, telecommunications, and audio processing.

Design Optimization Techniques:

To effectively harness the capabilities of 5SGXEBBR3H43C2N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to optimize power consumption of the 5SGXEBBR3H43C2N FPGA and associated components. Utilize dynamic voltage and frequency scaling (DVFS) techniques to adjust power levels based on workload demands.

2. Signal Integrity:

Ensure proper signal integrity by employing techniques such as impedance matching, signal termination, and minimizing signal crosstalk. Utilize high-quality PCB layout practices and proper grounding techniques to mitigate signal integrity issues.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating of the 5SGXEBBR3H43C2N FPGA. Utilize heatsinks, thermal vias, and fans for heat dissipation. Optimize airflow within the system enclosure to maintain optimal operating temperatures.

4. Resource Utilization:

Optimize resource utilization by carefully mapping the design onto the 5SGXEBBR3H43C2N FPGA. Utilize advanced synthesis and optimization tools to maximize the utilization of logic elements, memory blocks, and DSP resources while minimizing routing congestion.

5. Design Partitioning:

Partition the design into manageable blocks and leverage hierarchical design methodologies to improve design scalability and maintainability. Utilize intellectual property (IP) cores and pre-optimized modules to accelerate the development process and reduce time-to-market.

Considerations:

When designing with 5SGXEBBR3H43C2N, it's important to consider:

- Design Constraints: Understand the limitations and constraints of the 5SGXEBBR3H43C2N FPGA, including logic capacity, memory resources, and I/O capabilities.

- Timing Closure: Employ advanced timing analysis and closure techniques to ensure that the design meets timing requirements and achieves maximum performance.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to verify functionality, performance, and reliability before deployment.

- Security Considerations: Implement security features such as encryption, authentication, and access control mechanisms to protect sensitive data and intellectual property stored within the 5SGXEBBR3H43C2N FPGA.

- Future Expansion: Design the system with scalability in mind to accommodate future enhancements and upgrades, ensuring long-term viability and flexibility of the solution.

5SGXEBBR3H43C2N FAQ

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3. Are the 5SGXEBBR3H43C2N price and inventory displayed accurate?

The price and inventory of 5SGXEBBR3H43C2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEBBR3H43C2N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEBBR3H43C2N we delivered, we will accept the replacement or return of the 5SGXEBBR3H43C2N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEBBR3H43C2N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations