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Name: 5SGXEBBR2H43I2LN
Brand: Intel
SKU: 5SGXEBBR2H43I2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEBBR2H43I2LN

Part No.:: 5SGXEBBR2H43I2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEBBR2H43I2LN.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2001

Quantity:: Add To Cart

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5SGXEBBR2H43I2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

5SGXEBBR2H43I2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEBBR2H43I2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEBBR2H43I2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEBBR2H43I2LN information

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5SGXEBBR2H43I2LN Application Introduction

5SGXEBBR2H43I2LN is a high-density FPGA (Field-Programmable Gate Array) device manufactured by Intel. It offers advanced features suitable for a wide range of applications, including telecommunications, industrial automation, and automotive electronics.

Application Scenario:

In the realm of telecommunications, 5SGXEBBR2H43I2LN can be utilized for implementing high-speed data processing algorithms, such as error correction and signal modulation/demodulation in communication systems.

Circuit Design:

To effectively harness the capabilities of 5SGXEBBR2H43I2LN in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure stable operation of 5SGXEBBR2H43I2LN and associated peripherals. Utilize power gating techniques and low-power design methodologies to optimize energy usage.

2. Signal Integrity:

Pay careful attention to signal integrity considerations to maintain the quality of high-speed data transmission within the FPGA and across external interfaces. Employ techniques such as impedance matching, signal termination, and PCB layout optimization to mitigate signal integrity issues.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure reliable operation of 5SGXEBBR2H43I2LN in demanding environments. Employ heatsinks, thermal vias, and proper airflow design to dissipate heat generated during FPGA operation.

4. Design Partitioning:

Break down the design into manageable partitions to facilitate efficient utilization of FPGA resources and optimize performance. Utilize hierarchical design methodologies and design reuse techniques to streamline development and improve design scalability.

5. Clock Management:

Implement robust clocking architectures to ensure synchronous operation and timing closure within the FPGA design. Utilize clock skew analysis, clock domain crossing techniques, and PLL (Phase-Locked Loop) optimization to achieve reliable timing performance.

Considerations:

When designing with 5SGXEBBR2H43I2LN, keep the following considerations in mind:

- Resource Utilization: Optimize resource utilization within the FPGA to maximize performance and minimize area overhead.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Validation: Conduct thorough testing and verification to ensure functional correctness and reliability of the FPGA design across various operating conditions and use cases.

- Design Documentation: Maintain comprehensive documentation throughout the design process to facilitate design review, debugging, and future iterations of the project.

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3. Are the 5SGXEBBR2H43I2LN price and inventory displayed accurate?

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6. What is the process for return or replacement of 5SGXEBBR2H43I2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEBBR2H43I2LN we delivered, we will accept the replacement or return of the 5SGXEBBR2H43I2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEBBR2H43I2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations