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Name: 5SGXEBBR2H43C3N
Brand: Intel
SKU: 5SGXEBBR2H43C3N
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEBBR2H43C3N

Part No.:: 5SGXEBBR2H43C3N

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEBBR2H43C3N.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2865

Quantity:: Add To Cart

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5SGXEBBR2H43C3N Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEBBR2H43C3N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEBBR2H43C3N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEBBR2H43C3N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEBBR2H43C3N information

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5SGXEBBR2H43C3N Application Introduction

5SGXEBBR2H43C3N is a high-performance FPGA chip designed by Intel, offering extensive logic resources, memory capacity, and flexibility for advanced digital designs.

Application Overview:

In digital signal processing applications, 5SGXEBBR2H43C3N can be utilized for tasks such as real-time data processing, image recognition, and communications signal modulation.

Circuit Design:

To effectively utilize 5SGXEBBR2H43C3N in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of resources and minimize power consumption. Utilize the FPGA's power gating features and dynamic voltage scaling capabilities to adapt to varying processing demands and conserve energy.

2. Signal Integrity:

Pay special attention to signal integrity to maintain reliable communication and data integrity within the FPGA and with external components. Properly terminate high-speed signal lines, minimize signal reflections, and employ impedance matching techniques to mitigate signal integrity issues.

3. Thermal Management:

Manage the thermal performance of 5SGXEBBR2H43C3N to prevent overheating and ensure reliable operation. Use thermal analysis tools to identify hotspots and optimize the placement of critical components to enhance heat dissipation. Additionally, consider active cooling solutions such as heat sinks or fans to maintain optimal operating temperatures.

4. Resource Utilization:

Optimize the utilization of logic resources, memory blocks, and I/O pins within 5SGXEBBR2H43C3N to maximize performance and minimize resource conflicts. Utilize synthesis and optimization tools provided by the FPGA development environment to streamline the design and minimize resource wastage.

5. Design Partitioning:

Partition the design into manageable modules and leverage the hierarchical design approach to facilitate easier debugging, testing, and scalability. Utilize the FPGA's routing resources efficiently to minimize routing congestion and reduce overall design complexity.

Considerations:

When designing with 5SGXEBBR2H43C3N, it's essential to consider:

- Timing Closure: Perform thorough timing analysis and optimization to ensure that the design meets timing constraints and achieves the desired performance.

- Design Security: Implement security measures such as encryption and authentication to protect the intellectual property and sensitive data stored within the FPGA.

- Design Verification: Conduct comprehensive simulation and verification tests to validate the functionality, performance, and reliability of the design under various operating conditions.

- Design Documentation: Maintain detailed documentation throughout the design process to facilitate future revisions, troubleshooting, and knowledge transfer.

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6. What is the process for return or replacement of 5SGXEBBR2H43C3N?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEBBR2H43C3N we delivered, we will accept the replacement or return of the 5SGXEBBR2H43C3N only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEBBR2H43C3N.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations