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Name: 5SGXEBBR2H43C2LN
Brand: Intel
SKU: 5SGXEBBR2H43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEBBR2H43C2LN

Part No.:: 5SGXEBBR2H43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEBBR2H43C2LN.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 3397

Quantity:: Add To Cart

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5SGXEBBR2H43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEBBR2H43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEBBR2H43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEBBR2H43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEBBR2H43C2LN information

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5SGXEBBR2H43C2LN Application Introduction

5SGXEBBR2H43C2LN is a high-performance FPGA chip known for its versatility and capability to handle complex digital designs. When utilizing 5SGXEBBR2H43C2LN in a design project, several optimization techniques can enhance its effectiveness across various aspects such as power management, signal integrity, and thermal management.

Power Management:

To optimize power management with 5SGXEBBR2H43C2LN, consider the following strategies:

- Utilize advanced power gating techniques to selectively power down unused logic blocks within the FPGA, reducing overall power consumption during idle or low-activity periods.

- Implement dynamic voltage and frequency scaling (DVFS) techniques to adjust the operating voltage and clock frequency of the FPGA dynamically based on workload requirements, optimizing power efficiency without compromising performance.

- Employ intelligent power supply design with efficient voltage regulators and decoupling capacitors to ensure stable and clean power delivery to the FPGA and associated components, minimizing noise and voltage fluctuations.

Signal Integrity:

To maintain robust signal integrity in 5SGXEBBR2H43C2LN-based designs, consider the following best practices:

- Implement proper impedance matching techniques for high-speed interfaces such as DDR memory interfaces or high-speed serial links, ensuring minimal signal reflections and maximum signal integrity.

- Utilize high-quality PCB layout practices with controlled impedance traces, minimal signal crosstalk, and optimized routing to minimize signal degradation and ensure reliable data transmission.

- Incorporate advanced signal conditioning circuits, such as equalization and pre-emphasis, to compensate for signal losses and distortions over long traces or through connectors, maintaining signal integrity over extended transmission distances.

Thermal Management:

Effective thermal management is crucial for ensuring the reliability and longevity of 5SGXEBBR2H43C2LN-based systems. Consider the following thermal optimization techniques:

- Implement efficient heat sinking solutions, such as heat sinks or thermal vias, to dissipate heat generated by the FPGA and associated components, preventing thermal hotspots and ensuring consistent operating temperatures.

- Utilize thermal simulation tools to analyze and optimize the thermal performance of the entire system, identifying potential hotspots and optimizing airflow or heat dissipation mechanisms to maintain safe operating temperatures.

- Design the enclosure or chassis of the system with adequate ventilation and airflow paths to facilitate natural or forced convection cooling, preventing heat buildup and ensuring reliable operation even in challenging environmental conditions.

Conclusion:

By incorporating these design optimization techniques for power management, signal integrity, and thermal management, 5SGXEBBR2H43C2LN-based projects can achieve superior performance, reliability, and efficiency across a wide range of applications.

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6. What is the process for return or replacement of 5SGXEBBR2H43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEBBR2H43C2LN we delivered, we will accept the replacement or return of the 5SGXEBBR2H43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEBBR2H43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations