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Name: 5SGXEBBR1H43C2LN
Brand: Intel
SKU: 5SGXEBBR1H43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEBBR1H43C2LN

Part No.:: 5SGXEBBR1H43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEBBR1H43C2LN.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2532

Quantity:: Add To Cart

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5SGXEBBR1H43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
359200
NumberofLogicElements/Cells:
952000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEBBR1H43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEBBR1H43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEBBR1H43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEBBR1H43C2LN information

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5SGXEBBR1H43C2LN Application Introduction

5SGXEBBR1H43C2LN is a high-performance FPGA (Field-Programmable Gate Array) device manufactured by Intel, offering a wide range of capabilities for advanced digital design projects.

Application Scenario:

In telecommunications infrastructure, 5SGXEBBR1H43C2LN can be utilized for implementing signal processing algorithms, such as those used in baseband processing for wireless communication systems.

Design Optimization:

To effectively utilize 5SGXEBBR1H43C2LN in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal power utilization and minimize power consumption of the 5SGXEBBR1H43C2LN device and associated components. Utilize dynamic voltage and frequency scaling (DVFS) techniques to adjust power levels based on workload requirements.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout and minimizing signal trace lengths. Employ techniques such as impedance matching, signal termination, and proper grounding to mitigate signal reflections and noise interference, ensuring reliable data transmission within the FPGA and with external components.

3. Thermal Management:

Implement effective thermal management strategies to prevent overheating and ensure reliable operation of the 5SGXEBBR1H43C2LN device. Utilize proper heat sinks, thermal vias, and airflow management techniques to dissipate heat generated during operation and maintain optimal operating temperatures.

4. Resource Utilization:

Optimize resource utilization within the FPGA by efficiently mapping logic functions and allocating resources such as logic elements, memory blocks, and DSP slices. Utilize advanced synthesis and optimization tools provided by Intel Quartus Prime to maximize performance and minimize resource usage.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate easier development, debugging, and maintenance. Utilize hierarchical design techniques and IP (Intellectual Property) reuse to modularize the design and promote scalability and reusability.

Considerations:

When optimizing the design, consider the following factors:

- Timing Closure: Ensure that timing constraints are met to achieve reliable operation and prevent timing violations.

- Resource Constraints: Be mindful of resource limitations and plan the design accordingly to avoid resource conflicts and optimize resource usage.

- Design Verification: Thoroughly verify the design through simulation and testing to identify and rectify any functional or performance issues before deployment.

- Design Security: Implement security measures, such as encryption and access control, to protect intellectual property and sensitive data stored within the FPGA.

- Design Documentation: Maintain comprehensive documentation throughout the design process to facilitate collaboration, troubleshooting, and future modifications.

5SGXEBBR1H43C2LN FAQ

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3. Are the 5SGXEBBR1H43C2LN price and inventory displayed accurate?

The price and inventory of 5SGXEBBR1H43C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEBBR1H43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEBBR1H43C2LN we delivered, we will accept the replacement or return of the 5SGXEBBR1H43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEBBR1H43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations