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Name: 5SGXEB9R3H43C3G
Brand: Intel
SKU: 5SGXEB9R3H43C3G
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB9R3H43C3G

Part No.:: 5SGXEB9R3H43C3G

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 3473

Quantity:: Add To Cart

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5SGXEB9R3H43C3G Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Active
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB9R3H43C3G this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB9R3H43C3G price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB9R3H43C3G to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB9R3H43C3G information

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The working principle and core technical features of 5SGXEB9R3H43C3G

5SGXEB9R3H43C3G is a high-performance FPGA from the Stratix V family, known for its advanced features and robust architecture, making it suitable for a wide range of applications.

Application Scenario:

In high-speed data processing systems, this chip can be employed to accelerate computations, such as in financial trading platforms or scientific research simulations.

Working Principle:

The 5SGXEB9R3H43C3G operates based on a highly parallel architecture, utilizing thousands of logic elements and DSP blocks to perform complex calculations simultaneously. It features a reconfigurable logic fabric that allows designers to implement custom hardware accelerators tailored to specific tasks.

Core Technical Features:

1. High Logic Density: The chip contains over 900,000 adaptive logic modules (ALMs), enabling the implementation of large and complex designs.

2. Embedded Memory Blocks: It includes a substantial amount of embedded memory, which helps to store intermediate data and reduces the need for external memory access, thereby improving processing speed.

3. High-Speed Transceivers: The FPGA is equipped with multiple high-speed transceivers that support data rates up to 28 Gbps, making it ideal for high-bandwidth communication applications.

4. Advanced DSP Capabilities: The integrated DSP blocks allow for efficient implementation of mathematical operations, essential for signal processing applications.

Application Effects and Technical Advantages:

Utilizing the 5SGXEB9R3H43C3G in a financial trading platform can significantly reduce latency, providing faster transaction processing and better market response. Its reconfigurable nature allows for continuous optimization and adaptation to new trading algorithms.

In scientific research simulations, this chip can handle vast amounts of data in real-time, accelerating computations for complex models such as climate simulations or molecular dynamics.

Enhancing System Performance and Efficiency:

To maximize the performance and efficiency of systems using the 5SGXEB9R3H43C3G, consider the following strategies:

1. Optimize Logic Utilization: Carefully design your logic to fully utilize the FPGA's resources, minimizing wasted ALMs and ensuring efficient operation.

2. Efficient Memory Management: Make use of the embedded memory blocks to store frequently accessed data, reducing the need for external memory access and improving overall system speed.

3. Utilize High-Speed Transceivers: Take advantage of the high-speed transceivers for data-intensive applications, ensuring that communication bottlenecks do not impede system performance.

4. Leverage DSP Blocks: Use the integrated DSP blocks for compute-intensive tasks, such as signal processing or matrix multiplications, to offload these operations from general logic resources.

5. Power Management: Implement power management techniques, such as dynamic voltage and frequency scaling, to optimize power consumption without compromising performance.

Considerations:

When integrating the 5SGXEB9R3H43C3G into your design, consider the following:

- Thermal Management: Ensure adequate cooling solutions to maintain optimal operating temperatures, especially in high-performance applications.

- Signal Integrity: Design your PCB layout to minimize signal interference and ensure reliable high-speed data transmission.

- Firmware Optimization: Develop efficient firmware algorithms to fully exploit the parallel processing capabilities of the FPGA.

- System Testing: Conduct thorough testing to validate the performance, reliability, and robustness of your system under various operating conditions.

5SGXEB9R3H43C3G FAQ

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3. Are the 5SGXEB9R3H43C3G price and inventory displayed accurate?

The price and inventory of 5SGXEB9R3H43C3G fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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5. How is the shipping arranged?

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 5SGXEB9R3H43C3G?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB9R3H43C3G we delivered, we will accept the replacement or return of the 5SGXEB9R3H43C3G only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB9R3H43C3G.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations