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Name: 5SGXEB9R3H43C2L
Brand: Intel
SKU: 5SGXEB9R3H43C2L
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB9R3H43C2L

Part No.:: 5SGXEB9R3H43C2L

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB9R3H43C2L.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2465

Quantity:: Add To Cart

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5SGXEB9R3H43C2L Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB9R3H43C2L this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB9R3H43C2L price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB9R3H43C2L to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB9R3H43C2L information

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5SGXEB9R3H43C2L Application Introduction

5SGXEB9R3H43C2L is a high-performance FPGA (Field Programmable Gate Array) device manufactured by Intel, offering advanced capabilities for various electronic design projects.

Application Scenario:

In digital signal processing applications, 5SGXEB9R3H43C2L can be utilized to implement complex algorithms for tasks such as image processing or communications signal modulation and demodulation.

Circuit Design:

To effectively utilize 5SGXEB9R3H43C2L in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of resources on 5SGXEB9R3H43C2L. Utilize power gating and dynamic voltage and frequency scaling (DVFS) to minimize power consumption during idle and low-activity periods.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Utilize proper termination techniques and impedance matching to maintain signal integrity, especially for high-speed interfaces.

3. Thermal Management:

Ensure adequate thermal dissipation for 5SGXEB9R3H43C2L to prevent overheating and ensure reliable operation. Utilize heatsinks, thermal vias, and proper airflow within the enclosure to dissipate heat effectively.

4. Resource Utilization:

Optimize the utilization of logic resources, memory blocks, and DSP slices on 5SGXEB9R3H43C2L by employing efficient coding practices and resource sharing techniques. Utilize the Intel Quartus Prime software's resource utilization analysis tools to identify and eliminate resource bottlenecks.

5. Clock Management:

Design a robust clocking architecture for 5SGXEB9R3H43C2L to ensure precise timing control and minimize clock skew. Utilize PLLs (Phase-Locked Loops) and clock distribution networks effectively to generate and distribute clock signals with minimal jitter.

Considerations:

When designing with 5SGXEB9R3H43C2L, keep in mind the following considerations:

- Design Validation: Perform thorough functional testing and timing analysis to verify the correctness and performance of the design before deployment.

- Design Security: Implement security features, such as bitstream encryption and secure boot, to protect the intellectual property and integrity of the design on 5SGXEB9R3H43C2L.

- Design for Manufacturability: Ensure the design is manufacturable by considering factors such as component availability, assembly complexity, and testability during the design phase.

- Future Expansion: Design the system with scalability in mind, allowing for future upgrades or expansions without significant redesign efforts.

- Compliance: Ensure the design complies with relevant industry standards and regulations, such as FCC regulations for electromagnetic compatibility (EMC) and safety standards for electronic devices.

5SGXEB9R3H43C2L FAQ

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3. Are the 5SGXEB9R3H43C2L price and inventory displayed accurate?

The price and inventory of 5SGXEB9R3H43C2L fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB9R3H43C2L?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB9R3H43C2L we delivered, we will accept the replacement or return of the 5SGXEB9R3H43C2L only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB9R3H43C2L.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations