5SGXEB9R2H43I2N

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Intel 5SGXEB9R2H43I2N

HIGH-RELIABILITY-COMPONENTS
Part No.:
5SGXEB9R2H43I2N
Manufacturer:
Intel
Package:
1760-BBGA, FCBGA
Datasheet:
5SGXEB9R2H43I2N.pdf
Description:
IC FPGA 600 I/O 1760HBGA
In Stock:
3420
Quantity:
  Add To Cart
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  • Purchase and inquiryPurchase and inquiry

    5SGXEB9R2H43I2N this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB9R2H43I2N price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB9R2H43I2N to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    5SGXEB9R2H43I2N information5SGXEB9R2H43I2N information

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    5SGXEB9R2H43I2N Application Introduction


    5SGXEB9R2H43I2N is a high-density FPGA device designed for demanding applications in fields such as telecommunications, aerospace, and high-performance computing. With its advanced features and capabilities, it offers significant opportunities for efficient and innovative design implementations.

    Power Management:

    Effective power management is crucial for maximizing the performance and reliability of 5SGXEB9R2H43I2N-based designs. Utilize power gating techniques to selectively power down unused modules or peripherals, reducing overall power consumption. Additionally, employ dynamic voltage and frequency scaling (DVFS) to adjust the operating voltage and frequency dynamically based on the workload, optimizing power efficiency without compromising performance.

    Signal Integrity:

    Ensuring signal integrity is essential for reliable data transmission and processing in 5SGXEB9R2H43I2N designs. Implement proper PCB layout techniques, such as controlled impedance traces and signal shielding, to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). Utilize advanced signal integrity analysis tools to validate the design and identify potential signal integrity issues early in the development process.

    Thermal Management:

    Effective thermal management is critical for preventing overheating and maintaining the long-term reliability of 5SGXEB9R2H43I2N-based systems. Utilize thermal analysis tools to identify hot spots and optimize the placement of heat sinks, fans, and other cooling mechanisms to ensure adequate thermal dissipation. Implement dynamic thermal management strategies, such as thermal throttling and dynamic fan control, to adjust the system's operating parameters based on temperature sensors' feedback, ensuring optimal performance under varying thermal conditions.

    Design Optimization:

    To maximize the performance and efficiency of 5SGXEB9R2H43I2N-based designs, consider the following optimization techniques:

    - Resource Utilization: Efficiently utilize the FPGA resources, such as logic elements, memory blocks, and DSP slices, to minimize resource wastage and maximize design flexibility.

    - Parallelism and Pipelining: Leverage parallel processing and pipelining techniques to exploit the FPGA's parallel computing capabilities and improve overall throughput and latency performance.

    - Algorithm Optimization: Optimize algorithms and logic implementations to reduce computational complexity and improve performance, leveraging the FPGA's parallelism and hardware acceleration capabilities.

    - Timing Closure: Ensure timing closure by properly constraining the design and employing timing-driven synthesis and optimization techniques to meet timing requirements and maximize operating frequency.

    - Design Reuse and Modularity: Promote design reuse and modularity by partitioning the design into reusable IP cores and modules, facilitating easier integration, testing, and maintenance of complex FPGA designs.

    Conclusion:

    Incorporating efficient power management, signal integrity, and thermal management techniques, along with design optimization strategies, can enable designers to harness the full potential of 5SGXEB9R2H43I2N FPGA devices and achieve optimal performance, reliability, and scalability in their designs.

    5SGXEB9R2H43I2N FAQ

    1. How to order 5SGXEB9R2H43I2N on icwhale.com?

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    We have a professional and experienced quality control team to strictly verify and test the 5SGXEB9R2H43I2N. All suppliers must pass our qualification reviews before they can publish their products including 5SGXEB9R2H43I2N on icwhale.com; we pay more attention to the channels and quality of 5SGXEB9R2H43I2N products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

    3. Are the 5SGXEB9R2H43I2N price and inventory displayed accurate?

    The price and inventory of 5SGXEB9R2H43I2N fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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    Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

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    5. How is the shipping arranged?

    Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

    Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

    Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

    6. What is the process for return or replacement of 5SGXEB9R2H43I2N?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB9R2H43I2N we delivered, we will accept the replacement or return of the 5SGXEB9R2H43I2N only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB9R2H43I2N.

    (3)The PartNo is unused and only in the original unpacked packaging.

    Two processes to return the products:

    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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