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Name: 5SGXEB9R2H43C2LN
Brand: Intel
SKU: 5SGXEB9R2H43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB9R2H43C2LN

Part No.:: 5SGXEB9R2H43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB9R2H43C2LN.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2502

Quantity:: Add To Cart

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5SGXEB9R2H43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB9R2H43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB9R2H43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB9R2H43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB9R2H43C2LN information

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5SGXEB9R2H43C2LN Application Introduction

5SGXEB9R2H43C2LN is a high-capacity FPGA device manufactured by Intel, offering extensive resources and capabilities for complex digital designs.

Application Scope:

In the realm of telecommunications, 5SGXEB9R2H43C2LN can be leveraged to implement advanced signal processing algorithms for tasks like channel coding and modulation/demodulation.

Circuit Design:

To harness the potential of 5SGXEB9R2H43C2LN in a telecommunications project, consider the following strategies:

1. Power Management:

Implement efficient power management techniques to optimize power consumption and ensure reliable operation of 5SGXEB9R2H43C2LN. Utilize power gating and dynamic voltage/frequency scaling where applicable to minimize power wastage and extend battery life in portable devices.

2. Signal Integrity:

Pay meticulous attention to signal integrity throughout the design process. Employ techniques such as impedance matching, controlled impedance routing, and signal termination to mitigate signal reflections, crosstalk, and jitter, ensuring robust communication between different components of the system.

3. Thermal Management:

Manage the thermal profile of 5SGXEB9R2H43C2LN to prevent overheating and maintain optimal operating conditions. Utilize proper heat sinking, thermal vias, and airflow design to dissipate heat effectively. Additionally, implement temperature sensors and thermal management algorithms to dynamically adjust device operation based on temperature variations.

4. Resource Utilization:

Optimize resource utilization within 5SGXEB9R2H43C2LN by employing efficient logic synthesis, placement, and routing techniques. Utilize hierarchical design methodologies, clock domain partitioning, and resource sharing where appropriate to maximize FPGA resource utilization and performance.

5. Design for Testability:

Incorporate built-in self-test (BIST) features and debug infrastructure into the design to facilitate comprehensive testing and debug of the 5SGXEB9R2H43C2LN-based system. Implement on-chip instrumentation, boundary scan, and remote debug interfaces to enable efficient diagnosis and troubleshooting during development and deployment.

Considerations:

When designing with 5SGXEB9R2H43C2LN, it's crucial to consider:

- Design Constraints: Adhere to timing, area, and power constraints specified by the FPGA datasheet and design tools to ensure design correctness and performance.

- Design Security: Implement security features such as device encryption, authentication, and secure boot to protect intellectual property and prevent unauthorized access or tampering.

- Design Validation: Perform thorough functional verification, simulation, and hardware-in-the-loop (HIL) testing to validate the design against the functional and performance requirements.

- Design Documentation: Maintain comprehensive design documentation, including design specifications, block diagrams, timing diagrams, and test plans, to facilitate collaboration, review, and future maintenance of the design.

- Design Evolution: Plan for future design evolution and scalability by incorporating flexibility, modularity, and upgradeability into the design architecture to accommodate future feature enhancements and technology advancements.

5SGXEB9R2H43C2LN FAQ

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The price and inventory of 5SGXEB9R2H43C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB9R2H43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB9R2H43C2LN we delivered, we will accept the replacement or return of the 5SGXEB9R2H43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB9R2H43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations