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Name: 5SGXEB9R1H43C2LN
Brand: Intel
SKU: 5SGXEB9R1H43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 5SGXEB9R1H43C2LN

Part No.:: 5SGXEB9R1H43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB9R1H43C2LN.pdf

Description:: IC FPGA 600 I/O 1760HBGA

In Stock:: 2799

Quantity:: Add To Cart

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5SGXEB9R1H43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
317000
NumberofLogicElements/Cells:
840000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB9R1H43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB9R1H43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB9R1H43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB9R1H43C2LN information

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5SGXEB9R1H43C2LN Application Introduction

5SGXEB9R1H43C2LN is a high-performance FPGA chip manufactured by Intel, offering advanced capabilities for complex digital designs and signal processing applications.

Application Overview:

In digital signal processing (DSP) projects, 5SGXEB9R1H43C2LN can be utilized to implement algorithms for tasks such as image processing, audio filtering, and telecommunications.

Circuit Design:

To effectively utilize 5SGXEB9R1H43C2LN in a DSP project, consider the following design optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and optimize performance. Utilize power gating and dynamic voltage scaling to control power usage during different operating modes.

2. Signal Integrity:

Pay careful attention to signal integrity throughout the design process. Use proper termination techniques, impedance matching, and routing guidelines to maintain signal quality and reduce noise interference.

3. Thermal Management:

Manage thermal issues effectively to ensure reliable operation and prevent overheating. Employ thermal vias, heat sinks, and airflow optimization techniques to dissipate heat generated by the FPGA and surrounding components.

4. Clocking Strategy:

Develop a robust clocking strategy to ensure synchronous operation and minimize clock skew. Use dedicated clocking resources within 5SGXEB9R1H43C2LN and carefully design clock distribution networks to achieve timing closure.

5. Resource Utilization:

Optimize resource utilization within the FPGA to maximize design efficiency and minimize area usage. Utilize hierarchical design methodologies, IP core reuse, and advanced synthesis optimizations to achieve better performance and resource utilization.

Considerations:

When designing with 5SGXEB9R1H43C2LN, keep in mind the following considerations:

- Algorithm Complexity: Ensure that the FPGA resources are sufficient to implement the desired DSP algorithms with the required performance and accuracy.

- Design Constraints: Take into account design constraints such as timing requirements, resource limitations, and interface compatibility to meet project specifications.

- Verification and Testing: Perform thorough verification and testing of the FPGA design to validate functionality, performance, and compliance with project requirements.

- Future Scalability: Design the FPGA system with scalability in mind to accommodate future updates, enhancements, and additional functionalities.

- Documentation and Maintenance: Maintain comprehensive documentation throughout the design process to facilitate troubleshooting, maintenance, and future development efforts.

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6. What is the process for return or replacement of 5SGXEB9R1H43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB9R1H43C2LN we delivered, we will accept the replacement or return of the 5SGXEB9R1H43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB9R1H43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations