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Name: 5SGXEB6R3F43C2LN
Brand: Intel
SKU: 5SGXEB6R3F43C2LN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 5SGXEB6R3F43C2LN

Part No.:: 5SGXEB6R3F43C2LN

Manufacturer:: Intel

Package:: 1760-BBGA, FCBGA

Datasheet:: 5SGXEB6R3F43C2LN.pdf

Description:: IC FPGA 600 I/O 1760FBGA

In Stock:: 2259

Quantity:: Add To Cart

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5SGXEB6R3F43C2LN Specifications

Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Series:
Stratix® V GX
ProductStatus:
Obsolete
NumberofLABs/CLBs:
225400
NumberofLogicElements/Cells:
597000
TotalRAMBits:
53248000
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.82V ~ 0.88V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 85°C (TJ)

5SGXEB6R3F43C2LN this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 5SGXEB6R3F43C2LN price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 5SGXEB6R3F43C2LN to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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5SGXEB6R3F43C2LN information

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5SGXEB6R3F43C2LN Application Introduction

5SGXEB6R3F43C2LN is a high-density FPGA device manufactured by Intel, offering advanced capabilities for complex digital design projects. It features a large number of logic elements, high-speed transceivers, and versatile I/O options, making it suitable for a wide range of applications.

Application Scope:

In digital signal processing (DSP) applications, 5SGXEB6R3F43C2LN can be utilized to implement sophisticated algorithms for tasks such as image and video processing, communication systems, and radar signal analysis.

Design Strategies:

To effectively utilize 5SGXEB6R3F43C2LN in a design project, consider the following strategies:

1. Power Management:

Implement efficient power management techniques to optimize the power consumption of the FPGA device and associated components. Utilize power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to minimize power consumption during both active and idle states.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout, minimizing trace lengths, and properly terminating high-speed signal lines. Utilize impedance matching techniques and incorporate signal integrity analysis tools to mitigate signal reflections and crosstalk.

3. Thermal Management:

Implement effective thermal management solutions to prevent overheating and ensure reliable operation of 5SGXEB6R3F43C2LN under varying operating conditions. Utilize heat sinks, fans, and thermal vias to dissipate heat efficiently and maintain optimal operating temperatures.

4. Resource Utilization:

Optimize the utilization of FPGA resources, including logic elements, memory blocks, and DSP slices, to maximize the performance and efficiency of the design. Utilize resource sharing, pipelining, and parallel processing techniques to minimize resource wastage and improve overall system throughput.

5. Design for Testability:

Design the FPGA system with built-in test features, such as boundary scan chains and self-test routines, to facilitate debugging and validation during development and production. Implement robust error detection and correction mechanisms to enhance system reliability and fault tolerance.

Considerations:

When designing with 5SGXEB6R3F43C2LN, it's important to consider:

- Design Constraints: Take into account the timing, area, and power constraints specified by the target application to ensure successful implementation and operation.

- Design Iteration: Plan for iterative design cycles to refine and optimize the FPGA design based on simulation results, performance metrics, and feedback from prototype testing.

- Design Security: Implement security features, such as encryption, authentication, and secure boot, to protect the intellectual property and sensitive data stored within the FPGA device from unauthorized access and tampering.

- Compliance and Standards: Ensure compliance with industry standards and regulations, such as RoHS, CE, and FCC, to meet the requirements for electromagnetic compatibility (EMC), electromagnetic interference (EMI), and environmental sustainability.

5SGXEB6R3F43C2LN FAQ

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3. Are the 5SGXEB6R3F43C2LN price and inventory displayed accurate?

The price and inventory of 5SGXEB6R3F43C2LN fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 5SGXEB6R3F43C2LN?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 5SGXEB6R3F43C2LN we delivered, we will accept the replacement or return of the 5SGXEB6R3F43C2LN only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 5SGXEB6R3F43C2LN.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations